11/16/09 -- Cadence Design Systems, Inc., the leader in global design innovation, announced today that it has extended and expanded the scope of its recently announced relationship with Toshiba Corporation for COT and SoC design targeting the growing and increasingly complex mobile and consumer markets.

11/04/09 -- Cadence Design Systems, Inc., the leader in global design innovation, announced today that Exar Corporation has signed an expanded business agreement to establish Cadence® as its leading chip planning and mixed-signal design solutions provider.

11/03/09 -- Cadence Design Systems, Inc., the leader in global electronic design innovation, today is celebrating Innovation Day, honoring the contributions Cadence® employees have made to the company and the electronics industry as a whole.

Cadence Design Systems, Inc., the leader in global electronic design innovation, today announced that it has delivered a comprehensive low-power design flow for engineers targeting the 65-nanometer process at Semiconductor Manufacturing International Corporation.

10/29/09 -- Cadence Design Systems, Inc., the leader in global electronic design innovation, today announced that it has delivered a comprehensive low-power design flow for engineers targeting the 65-nanometer process at Semiconductor Manufacturing International Corporation.

10/28/09 -- Cadence Design Systems, Inc. today announced results for the third quarter 2009. Cadence reported third quarter 2009 revenue of $216 million, compared to revenue of $232 million reported for the same period in 2008.

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10/27/09 -- Cadence Design Systems, Inc., the leader in global electronic design innovation, announced today that package designers will be able to play a greater role in co-design and design chain collaboration with the latest release of its system-in-package and IC packaging software.

10/27/09 -- Cadence Design Systems, Inc., the leader in global electronic design innovation, announced today the latest release of its Cadence® Allegro® and OrCAD® printed circuit board software, with new features and functionality designed to boost productivity and performance for PCB engineers.

10/27/09 -- Cadence Design Systems, Inc., the leader in global electronic design innovation, today announced that Silicon Hive, a worldwide supplier of semiconductor intellectual property, achieved the highest quality for its HiveGo mobile imaging and video decoding solutions using the Cadence® Palladium® III Accelerator/Emulator.