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altera corp (ALTR) Key Developments

Altera and TSMC Collaborate to Bring Advanced Packaging Technology to Arria 10 FPGAs and SoCs

Altera Corporation and TSMC announced the two companies have worked together to bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20 nm Arria 10 FPGAs and SoCs. Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance to Altera's 20 nm device family.

Altera Corp. Announces High-Efficiency Power Conversion Solution for High-Performance FPGA

Altera Corporation announced the availability of a new power conversion solution that makes it easy for board developers to design point-of-load power solutions and achieve the high FPGA performance at the lowest system power. The new power conversion solution, a monolithic 40A driver plus synchronous MOSFET powertrain, is optimized to meet the core requirements of Altera's high-performance Stratix(R) V, Arria(R) 10, and Stratix(R) 10 FPGAs and SoCs. It offers systems designers the high-density, high-efficiency power conversion they require when integrating high-performance FPGAs into their system. The new powertrain, (part number ET4040), meets the stringent core voltage requirements of high-performance FPGAs, processors and memory. Systems designers can leverage the 40A powertrain to efficiently power the FPGA's core supply rails in single-phase or multiphase configurations. It can also be used in VDDQ supply rails for DDR3, DDR4, and QDR memories as well as supplying all high-current supply rails for ASIC and ASSPs that are used in high-end servers and communications infrastructure systems. The ET4040 powertrain offers 40A continuous output current over industrial temperature range (-40C - + 85C) and across an input range of 4.5V to 14 V. It delivers low Rds-on and low switching loss while enabling high efficiency at high frequencies (up to 3 MHz switching frequency). The device's on-board monolithic current sense enables use of a lower loss inductor for better system efficiency while also providing a vast improvement in reliability and thermal performance over competing solutions on the market.

Harmonic Chooses Altera Solution for H.265 4Kp60 Video Encoding

Altera Corporation announced that Harmonic has chosen Altera's new 4Kp60-capable H.265 enhanced motion estimation engine (EME), a server co-processing solution based on the company's Stratix(R) V FPGAs to dramatically improve efficiency and performance of Harmonic's PURE Compression Engine for the delivery of 4Kp60 content. Altera's Stratix V FPGAs, optimized with IP from Altera and its partners, enable Harmonic's encoding technology to deliver 4Kp60 real-time performance, while requiring substantially less power, rack space and CPU processing power than other solutions prevalent in the industry. Altera's EME saves precious CPU cycles by offloading Server-class CPUs, reserving more processing power to deliver efficiency and video quality today, with spare capacity for even more improvements tomorrow. A demonstration of the products delivering 4Kp60 real-time performance will be featured in the Harmonic booth # SU1210 and Altera booth # SU11110 during the 2014 NAB Show in Las Vegas, April 7-10. The offering utilizes Altera's Advanced System Development Kit, built for demanding 4K and even 8K video transport and processing needs. In sharing the news at NAB, Mark Hoopes, who manages Altera's Video Codec Solutions said, "As video traffic explodes to consume the vast majority of available network bandwidth, and as users expect more content, anywhere, anytime, with significantly improved quality of experience, the need for a high quality H.265 encoder that enables typical bitrate savings of 50% becomes critical. Achieving such efficiency gains comes at an unprecedented increase in processing power required when compared to legacy H.264 or MPEG-2.

Altera Corp. and Intel Corporation Collaborate on Development of Multi-Die Devices

Altera Corporation and Intel Corporation have announced collaboration on the development of multi-die devices that leverage Intel's package and assembly capabilities and Altera's programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera's Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process. Altera's work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera's heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments. Intel's 14 nm Tri-Gate process density advantage and Altera's patented FPGA redundancy technology enable Altera to deliver the industry's high density monolithic FPGA die, offering greater integration of system components on a single die. Altera is leveraging its leadership in developing the large monolithic FPGA die and Intel's packaging technology to integrate even more capabilities into a single system-in-a-package solution. Intel's manufacturing process is co-optimized to offer manufacturing simplicity consisting of turnkey foundry services that include the manufacturing, assembly and testing of heterogeneous multi-die devices. Intel and Altera are currently developing test vehicles aimed at streamlining manufacturing and integration flows.

Altera Corporation and Intel Corporation Announce Collaboration on Development of Multi-Die Devices

Altera Corporation and Intel Corporation announced their collaboration on the development of multi-die devices that leverage Intel's world-class package and assembly capabilities and Altera's programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera's Stratix(R) 10 FPGAs and SoCs using the 14 nm Tri-Gate process. Altera's work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera's heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments. Intel's 14 nm Tri-Gate process density advantage and Altera's patented FPGA redundancy technology enable Altera to deliver the density monolithic FPGA die, offering greater integration of system components on a single die. Altera is leveraging its leadership in developing the monolithic FPGA die and Intel's packaging technology to integrate even more capabilities into a single system-in-a-package solution. Intel's manufacturing process is co-optimized to offer manufacturing simplicity consisting of turnkey foundry services that include the manufacturing, assembly and testing of heterogeneous multi-die devices. Intel and Altera are currently developing test vehicles aimed at streamlining manufacturing and integration flows.

 

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