Last $34.55 USD
Change Today +0.64 / 1.89%
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spansion inc-class a (CODE) Key Developments

DNP Selects Spansion's Energy Harvesting PMICs for Battery-Free Beacon Modules

Spansion Inc. and Dai Nippon Printing Co. Ltd., or DNP, have announced DNP has selected Spansion's energy harvesting power management integrated circuits, or PMICs, for its battery-free beacon modules to implement field experiments of indoor positioning and online to offline, or O2O, services in airports and shopping malls. Spansion's family of energy harvesting PMICs enable the development of eco-friendly IoT devices, which can be operated without battery or fuel. The PMICs implemented in the beacons can effectively extract energy from both sunlight and vibration. The power source is provided by the solar battery panels, which are embedded within the module and are half the size of a business card.

Cypress Semiconductor Corp. and Spansion, Inc. Announces Board Appointments

Cypress Semiconductor Corp. and Spansion Inc. announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion. The post-merger company will generate more than $2 billion in revenue annually and create a leading global provider of microcontrollers and specialized memories needed in today's embedded systems. The shareholders of each company will own approximately 50% of the post-merger company. The company will have an eight-person board of directors consisting of four Cypress directors, including T.J. Rodgers and Eric Benhamou, and four Spansion directors, including John Kispert and Ray Bingham, the Spansion chairman, who will serve as the non-executive chairman of the combined company, which will be headquartered in San Jose, California and called Cypress Semiconductor Corporation.

Cypress Semiconductor Corporation, Spansion Inc. - M&A Call

To merge in an all-stock, tax-free transaction valued at approximately $4 billion

Dai Nippon Printing Co., Ltd. Selects Spansion Inc.'s Energy Harvesting Power Management Integrated Circuits for Its Battery-Free Beacon Modules

Spansion Inc. and Dai Nippon Printing Co. Ltd. announced DNP has selected Spansion's energy harvesting power management integrated circuits for its battery-free beacon modules to implement field experiments of indoor positioning and O2O services in airports and shopping malls. Spansion's family of energy harvesting PMICs enable the development of eco-friendly IoT devices, which can be operated without battery or fuel. The PMICs implemented in the beacons can effectively extract energy from both sunlight and vibration. The power source is provided by the solar battery panels, which are embedded within the module and are half the size of a business card. The solar battery can be operated continuously using the amount of light equal to standard interior lighting used in everyday activities. As a joint initiative called "iBeacon Project" with Japan Airlines Co., Ltd, DNP's experimental service was launched in cooperation with JAL on October 9. This service is currently providing real-time departure, gate and other timely information for JAL Countdown application users from the battery-free beacon modules placed in the departure area of all Japan's major airports including Haneda Airport Terminal-1, New Chitose, Sendai, Narita, Komatsu, Itami, Kansai, Hiroshima, Matsuyama, Fukuoka, Naha, Kumamoto, and Kagoshima airports. Additionally, in cooperation with Aeon Mall Co. Ltd., DNP will launch a separate field experiment using the Spansion-powered battery-free beacon modules to deliver digital floor information and guides to Aeon mall visitors at the mall entrance. Leveraging the Spansion-based battery-free beacon modules, DNP plans to implement more field experiments at a variety of commercial facilities. DNP will expand its beacon-based services to include games, digital coupons, in-facility map information and product information. DNP expects these services will be widely introduced in large-sized facilities and tourist spots, including shopping malls, theme parks and museums. However, the work and cost of maintaining battery-powered beacons is too high a burden for operators since batteries wear out too fast.

Spansion Expands High Density Automotive Serial Flash with 125C Operation

Spansion Inc. expanded its automotive grade Serial NOR flash product line. Spansion's FL-S family in 128Mb and 256Mb densities has been qualified for the extended temperature range of -40C to +125C. The added temperature offerings meet Spansion's high standards for quality and performance, which embedded customers have come to rely on, and complement the existing serial flash memory portfolio, ranging from 4Mb to 1Gb. Key features of the 128Mb (S25FL128S) and 256Mb (S25FL256S) SPI devices: Extended operating temperature of -40C to +125C; Equivalent performance to Spansion's -40C to +105C range devices; Industry's fast SPI Read and Write performance; AEC-Q100 qualified; Meets the TS16949 standard and Production Part Approval Process (PPAP) requirements; SOIC, WSON, BGA packages; Extended addressing for access to higher memory density; Configurable read latency for faster access time or higher clock rates; Double Data Rate (DDR) read commands for SIO, DIO and QIO; Advanced sector protection for individually protecting each sector.

 

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