cypress semiconductor corp (CY) Key Developments
iConnectivity Uses Cypress Semiconductor Corp.'s CapSense(r) MBR3 Mechanical Button Replacement Solution
Dec 10 14
Cypress Semiconductor Corp. announced that iConnectivity is using Cypress's CapSense(r) MBR3 mechanical button replacement solution in its next-generation iConnectAUDIO4+ multi-host audio interface system. The CapSense Mechanical Button Replacement (MBR) CY. The iConnectAUDIO4+ supports multiple audio and Musical Instrument Digital Interface (MIDI) peripherals, and also multiple computing devices, all at once. This allows any combination of up to two Mac, PC and iOS devices to share the ports of the iConnectAUDIO4+ for seamless interaction with professional-grade audio from multiple sources. iConnectivity chose to implement capacitive touch sensing controls into its iConnectAUDIO4+ because standard buttons and knobs of previous-generation devices could not provide the flexibility and user interactivity required. The CapSense MBR3 solution enabled iConnectivity to maintain a small form factor and reduce BOM costs, while delivering top-quality touch performance.
Cypress Semiconductor Corporation's New Bluetooth Low Energy Solutions Earn Bluetooth 4.1 Qualification
Dec 9 14
Cypress Semiconductor Corporation announced its new highly integrated, single-chip Bluetooth® Low Energy solutions have achieved Bluetooth qualification. The Bluetooth Special Interest Group awarded specification 4.1 qualification to Cypress's Link Layer component, Bluetooth Low Energy protocol stack and radio frequency physical layer (RF Phy) used in the PSoC® 4 BLE Programmable System-on-Chip and PRoC™ BLE Programmable Radio-on-Chip solutions. Additionally, the solutions' chip-scale packages (CSP) and quad-flat no-lead (QFN) packages earned Bluetooth 4.1 qualification. Bluetooth 4.1 is designed to coexist with cellular technologies such as LTE and deliver better connections and improved data transfer, enabling developers to create innovative Internet of Things (IoT) applications. Customers designing with Cypress's Bluetooth Low Energy solutions can apply to add the Bluetooth logo on their products by referring to Cypress's qualification identification numbers. The Cypress Bluetooth Low Energy solutions enable complete systems by integrating a Bluetooth Smart radio, a high-performance 32-bit ARM® Cortex™-M0 core with ultra-low-power modes, programmable analog blocks, and Cypress's CapSense® capacitive touch-sensing functionality. This combination of technology delivers unmatched system value for Bluetooth Smart products, with prolonged battery life, customizable sensing capabilities, and sleek, intuitive user interfaces. PSoC 4 BLE delivers unprecedented ease-of-use and integration in a customizable solution for IoT applications, home automation, healthcare equipment, sports and fitness monitors, and other wearable smart devices. PRoC BLE provides a cost-effective turnkey solution for wireless Human Interface Devices (HIDs), remote controls and applications requiring simple wireless connectivity. The solutions also have an on-chip balun that simplifies antenna design while reducing board size and system cost.
Cypress Semiconductor Corporation Presents at Barclays Capital Global Technology Conference, Dec-10-2014 01:30 PM
Dec 4 14
Cypress Semiconductor Corporation Presents at Barclays Capital Global Technology Conference, Dec-10-2014 01:30 PM. Venue: Palace Hotel, 2 New Montgomery Street, San Francisco, California, United States. Speakers: Thad Trent, Chief Financial Officer and Executive Vice President of Finance & Administration.
Cypress Semiconductor Corp. and Spansion, Inc. Announces Board Appointments
Dec 1 14
Cypress Semiconductor Corp. and Spansion Inc. announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion. The post-merger company will generate more than $2 billion in revenue annually and create a leading global provider of microcontrollers and specialized memories needed in today's embedded systems. The shareholders of each company will own approximately 50% of the post-merger company. The company will have an eight-person board of directors consisting of four Cypress directors, including T.J. Rodgers and Eric Benhamou, and four Spansion directors, including John Kispert and Ray Bingham, the Spansion chairman, who will serve as the non-executive chairman of the combined company, which will be headquartered in San Jose, California and called Cypress Semiconductor Corporation.
Cypress Semiconductor Corporation, Spansion Inc. - M&A Call
Dec 1 14
To merge in an all-stock, tax-free transaction valued at approximately $4 billion