Last $12.33 USD
Change Today +0.56 / 4.76%
Volume 212.7K
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As of 8:04 PM 08/29/14 All times are local (Market data is delayed by at least 15 minutes).

magnachip semiconduct (MX) Key Developments

MagnaChip Semiconductor Corporation announced delayed 10-Q filing

On 08/12/2014, MagnaChip Semiconductor Corporation announced that they will be unable to file their next 10-Q by the deadline required by the SEC.

MagnaChip Semiconductor Corporation Signs a Joint Development Agreement with Yield Microelectronics Corporation to Develop a Family of Embedded 0.18um Standard Multiple Time Programmable IP Solutions

MagnaChip Semiconductor Corporation announced that it has signed a joint development agreement with Yield Microelectronics Corporation to develop a family of embedded 0.18um standard Multiple Time Programmable (MTP) IP solutions. The MTP-IP joint development agreement covers a variety of standard memory cell sizes suited for embedded applications such as touch control panels, code storage, trimming design and microcontrollers. By adding YMC's MTP-IP solutions to MagnaChip's existing non-volatile memory (NVM) technology portfolio, MagnaChip will provide enhanced foundry services to its global customers through competitive IC designs and NVM performance targeted at next generation mobile and industrial applications. Touch control panels are widely used in mobile devices, navigation equipment, digital cameras and other consumer products. By adopting YMC's MTP-IP solutions, foundry customers can take advantage of high voltage (HV) features in addition to added NVM functionality. Utilizing these solutions will directly lead to improved signal-to-noise ratio characteristics and increased performance of touch control panels in comparison with pure CMOS process. YMC's MTP-IP solutions allow the control unit in each touch panel to be integrated and create an optimal touch sensing solution. In addition, YMC's MTP IP can utilize MagnaChip's CMOS manufacturing process to replace existing embedded flash. This is a competitive advantage for foundry customers seeking to provide new generation touch panels with high-performance and cost-effective embedded solutions. With the addition of YMC's MTP solution utilizing MagnaChip's Bipolar-CMOS-DMOS (BCD) manufacturing processes, customers will have the added flexibility of being able to expand into new areas and applications such as microcontrollers.

MagnaChip Semiconductor Corporation to Offer Competitive Embedded Multiple Time Programmable (MTP) IP Solutions

MagnaChip Semiconductor Corporation announced that it has signed a joint development agreement with Yield Microelectronics Corporation to develop a family of embedded 0.18um standard Multiple Time Programmable (MTP) IP solutions. The MTP-IP joint development agreement covers a variety of standard memory cell sizes suited for embedded applications such as touch control panels, code storage, trimming design and microcontrollers. By adding YMC's MTP-IP solutions to MagnaChip's existing non-volatile memory (NVM) technology portfolio, MagnaChip will provide enhanced foundry services to its global customers through competitive IC designs and NVM performance targeted at next generation mobile and industrial applications. Touch control panels are widely used in mobile devices, navigation equipment, digital cameras and other consumer products. By adopting YMC's MTP-IP solutions, foundry customers can take advantage of high voltage (HV) features in addition to added NVM functionality. Utilizing these solutions will directly lead to improved signal-to-noise ratio characteristics and increased performance of touch control panels in comparison with pure CMOS process. YMC's MTP-IP solutions allow the control unit in each touch panel to be integrated and create an optimal touch sensing solution. In addition, YMC's MTP IP can utilize MagnaChip's CMOS manufacturing process to replace existing embedded flash. This is a competitive advantage for foundry customers seeking to provide new generation touch panels with high-performance and cost-effective embedded solutions. With the addition of YMC's MTP solution utilizing MagnaChip's Bipolar-CMOS-DMOS (BCD) manufacturing processes, customers will have the added flexibility of being able to expand into new areas and applications such as microcontrollers.

MagnaChip Semiconductor and SENIS Sign Patent License Agreement

MagnaChip Semiconductor Corporation announced that it has signed a patent license agreement with SENIS AG. With the agreement, MagnaChip acquires the right to use a portfolio of SENIS' patents covering magnetic field and current measurement technologies in its sensor products. MagnaChip expects the agreement to significantly strengthen the company's existing initiatives in sensors and allow development of sensor solutions for new industrial and consumer applications. MagnaChip's existing portfolio of sensors includes the e-Compass and MXM11XX Digital Hall sensor family.

MagnaChip Semiconductor Corporation Announces Management Changes

MagnaChip Semiconductor Corporation announced that Sang Park, 67, has retired as Chairman, Chief Executive Officer and Director, effective immediately. The board has appointed Young-Joon (YJ) Kim, MagnaChip's Executive Vice President and General Manager of the Display Solutions Division, to serve as interim Chief Executive Officer. Mr. Kim, a 25-year veteran of the semiconductor industry, will also retain his existing responsibilities. MagnaChip's board has separated the roles of Chairman and CEO and appointed R. Douglas Norby, Chairman of the Audit Committee, to the position of non-executive Chairman. The board will immediately begin the search for a permanent CEO and will be engaging a prominent international search firm to lead the recruitment effort. Mr. Norby has been a member of MagnaChip's Board of Directors and the Chairman of the Audit Committee since March 2010 and also served in these roles from May 2006 to October 2008. Mr. Kim has served as MagnaChip's Executive Vice President and General Manager of Display Solutions Division since May 2013. He joined MagnaChip from Cavium Inc., where he was Vice President of the Infrastructure Processor Division and General Manager of the Multi-core Processor Group.

 

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