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nxp semiconductors nv (NXPI) Key Developments

NXP Semiconductors N.V. Appoints Rick Tsai as Non-Executive Director, July 1, 2014

NXP Semiconductors N.V. announced that Dr. Rick Tsai has been appointed as non-executive director in its Board of Directors, effective July 1, 2014. As of January 28, 2014, Dr. Tsai is Chairman and Chief Executive Officer of Chunghwa Telecom Co. Ltd. Prior to joining Chunghwa Telecom, Dr. Tsai served as the Chairman and Chief Executive Officer of TSMC Solar and TSMC Solid State Lighting since 2011.

NXP Semiconductors N.V. Announces the Availability of the TEF510x

NXP Semiconductors N.V. has announced the availability of the TEF510x, the second product from the RoadLINK range, to automotive original equipment manufacturers, or OEMs, and Tier 1 suppliers for design-in. The TEF510x is a dual radio multi band RF transceiver for Car-to-X (C2X) applications. Supporting global C2X and Wi-Fi standards, the TEF510x provides OEMs with an optimized solution to meet 802.11p modem functionality on one chip. The chip has the flexibility to support global deployments and various system configurations. The TEF510x RF transceiver meets Japanese 760Mz C2X requirements, US and European (5.9GHz) as well as Wi-Fi and DSRC (5.8GHz) specifications. It will be released for automotive production in 2015 and is expected to be available to consumers as early as 2016. Together with the NXP/Cohda Wireless SAF510x baseband processor, powered by software defined radio technology, the RoadLINK chip provides fast, accurate and reliable communication to and from the vehicle. RoadLINK takes C2X communications to the next level by bringing safety-critical information to the driver significantly faster than current, conventional applications can.

NXP Semiconductors N.V. Introduces New Smartphone Quick-Jack Solution

NXP Semiconductors N.V. has introduced a new Smartphone Quick-Jack Solution that enhances connection of external devices to smartphones for self-powered data communications. Adapting the standard 3.5mm audio jack found on smartphones, the Solution creates a universal interface for external sensors, switches, peripherals and other devices. Inspired by the University of Michigan's Project HiJack, it gives mobile, consumer and industrial product designers simple, plug-and-go connectivity for adding features to a variety of applications, from wearable medical and fitness devices, gaming controllers, and toys, to diagnostics and maintenance tools. Many app features depend on connectivity with external devices to collect readings from sensors, control switches, data collected by external meters, as well as act on user inputs from keyboard, wands, or joysticks and more. For these types of apps, tying up the phone's high-bandwidth USB/Lightning port is unnecessary. While wireless connectivity offers user convenience; it can also increase BOM cost in small devices and requires experience working with wireless protocols, and an external power source. By repurposing the audio jack, the Smartphone Quick-Jack solution makes communication with external devices as easy as plugging in headphones.

NXP Semiconductors N.V. Unveils New Family of Single Stage Driver ICs for LED Lighting Solutions

NXP Semiconductors N.V. unveiled a new family of single stage driver ICs for LED lighting solutions. Complementing NXP's broad range of GreenChip SSL products, the new platform includes the SSL5301T, SSL5306T, SSL5307T, SSL5511T and SSL5101T LED driver solutions from 4 Watt up to 50 Watt of lamp power. All products have been designed in the compact and economical SO-8 package. The product family is applicable for Buck, Buck-Boost or Flyback, in non-isolated or isolated topologies and includes three selectable modes: Low ripple, Eco-Low THD (PF>0.75) or Low THD (PF>0.9). The solutions also provide benefits through accurate LED current and line regulation and compatibility with wall switches with built-in indication light during standby. The LED driver ICs have been designed to start up directly from the high-voltage (HV) supply by an internal JFET current source and incorporate all required protection features. The SSL5301T, SSL5306T, SSL5307T single stage LED driver ICs are designed and optimized for mains-dimmable (phase cut dimmable) LED driver solutions. The SSL5301/06/07T can detect all known mains dimmer types and translate the dimmer setting to a continuous LED current in multiple ways. The SSL5301T, SSL5511 and SSL5101, drive an external switch for easy power scaling up to 50Watt of lamp power. The SSL5306T and SSL5307T have an incorporated MOSFET of 700V/10Ohm to support compact solutions up to 10Watt of lamp power. The SSL5306T is designed for Buck topology and the SSL5307T Buck-Boost Topology and will be released for mass production in Third Quarter 2014. The SSL5511T is a compact single stage LED driver IC for offline dimmable LED driver solutions with a control input signal for dimming such as remote-controlled luminaires and smart lamps. The SSL5101T targets non-dimmable LED fixture solutions or higher power isolated LED retrofit solutions. With the introduction of the platform, NXP also adds fourteen new reference boards to the NXP LED Driver Solutions Selection Guide. NXP's cost-effective LED Driver Solutions simplify lamp design with the right form factor to streamline the design-in process, and extend lifetime and reliability.

NXP Semiconductors N.V. Introduces SSL5015/18 Driver IC for LED Solutions

NXP Semiconductors N.V. has introduced the SSL5015/18, a compact driver IC for LED solutions. The SSL5015 is optimized for US and Japan, while the SSL5018 is designed for Europe and Asia. By introducing the SSL5015/18, NXP also adds four new reference boards to the NXP LED Driver Solutions Selection Guide. NXP's cost-effective LED Driver Solutions simplify lamp design with the right form factor to streamline the design-in process, and extend lifetime and reliability. The SSL5015/18 offers customers a cost-effective, non-isolated solution with a high lamp power factor (PF) up to 0.9. Engineers can also tailor the demo board quickly and easily to suit their individual needs using NXP's online design tool. This tool decreases time to market and reduces margin for error with simulation capabilities.

 

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