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renesas electro-unspon adr (RNECY) Key Developments

Renesas Electronics Corporation Announces ARM Cortex-A Processor-Based mbed Microprocessor Board

Renesas Electronics Corporation simplifying embedded design for engineers and developers in the Maker space and working on emerging applications via the recently-launched ARM mbed IoT Device platform. Leveraging its RZ/A1 microprocessor, Renesas has developed the world's first ARM Cortex-A9 processor-based mbed microprocessor board, which will enable quicker development of high-performance, high-functionality embedded systems for designers of interconnected devices. The ARM mbed IoT Device Platform offers a new software platform and free operating system to simplify and speed up the creation and deployment of Internet of Things (IoT) products. It offers development tools for professional and amateur developers, including command-line tools and a cloud-based integrated development environment (IDE), focusing on connectivity, energy-efficiency, security and productivity. Utilizing an apps processor, the ARM Cortex-A9 CPU, inside the RZ/A1 allows developers to reuse software developed for the Cortex-M family, while at the same time gaining enhanced performance and features. The RZ/A1 microprocessor also supports the CMSIS (Cortex Microcontroller Software Interface Standard), allowing developers to port multi-threaded Cortex-M family software to the Cortex-A9 core without major modifications. The RZ/A1 Group of microprocessors is built around an ARM Cortex-A9 CPU that clocks at 400 MHz and 1000 DMIPS and features large on-chip RAM capacity of up to 10 MB. The RZ/A1 microprocessor delivers approximately four times the DMIPS performance and 40 times the RAM capacity of other ARM mbed products. By making use of features like the camera input, graphics accelerator, and audio processing functions of the RZ/A1 microprocessor, engineers can implement highly expressive and easy-to-use solutions on the RZ/A1 platform quickly and efficiently. The ARM mbed IoT Device Platform is designed to simplify the deployment of IoT products by delivering a free operating system and licensable software platform providing server-side technologies. It has been built around open standards and will bring Internet protocols, security and standards-based manageability into one integrated solution, optimized for energy and cost-constrained devices. It is supported by the established and expanding mbed hardware and software ecosystem that will provide common building blocks for IoT devices and services. The platform will accelerate the growth of the IoT by enabling innovators to focus on value-add features and differentiation. Renesas RZ/A1 boards with mbed support are currently being developed by Renesas and its partners, and will be available from December 2014.

Renesas Electronics Corporation Announces New RH850/P1x-C Series

Renesas Electronics Corporation announced new RH850/P1x-C Series, a high-end version of the RH850/P1x Series of 32-bit automotive microcontrollers (MCUs), is designed for sensor fusion, gateway, and advanced chassis system applications that will enable the types of advanced systems envisioned in the car of the future. Renesas Electronics RH850/P1x-C Series of 32-bit automotive microcontrollers deliver functional safety, encryption, performance and communications for driver assistance systems that enable self-driving cars. Security and safety expectations are on the rise as carmakers endeavor to build vehicles that deliver a more enjoyable, convenient, and safe driving experience. While already deployed in vehicle safety systems, driver assistance systems have rapidly become more sophisticated in the lead up to self-driving cars. In order to fully realize this autonomous vision, Renesas believes that solutions are required in four areas - safety, security, sensors, and networks - and has leveraged its experience, which incorporates all four requirements on a single chip to deliver an all-in-one solution for driver assistance systems. Renesas intends to continue to develop solutions like the RH850/P1x-C Series that generate new value in next-generation vehicle systems designed to meet these expectations. Safety: Functional safety is essential to ensure the driver assistance system is operating safely and normally and, should a fault occur, to ensure that safety is not compromised. Levering its insights and experience with functional safety standardization, Renesas has designed the RH850/P1x-C Series with a full complement of functions to support functional safety and comply with ASIL D, the safety level stipulated in the ISO 26262 functional safety standard for road vehicles. The RH850/P1x-C Series is equipped with fault diagnostic functions ideal for automotive applications. Two CPUs with identical configurations operate in a lockstep system. Error check and correct (ECC) functionality detects and corrects data errors affecting memory, such as flash memory, and the internal buses. Fault detection functions for system diagnostics are also included in the peripheral functions. The built-in self-test (BIST) function can detect faults in the various fault detection functions themselves. The error control module (ECM) allows users to manage error signal inputs, based on the circumstances, from the various functions, thereby helping to maintain system safety and reliability. Security: In the era of connected cars, in-vehicle, vehicle-to-vehicle, and vehicle-to-infrastructure networks are becoming mainstream. This connectivity allows systems to obtain information on road conditions and other factors that could impact the driving experience. It also requires robust security measures to ensure the systems are protected from unauthorized external access. The RH850/P1x-C Series integrates a new hardware security module with a coprocessor supporting data encryption and random number generation to address these mission-critical security requirements, for example building anti-tampering measures into vehicle systems. Sensors: In order to be able to respond to all types of conditions while driving, vehicles are using an increasing number of sensors, such as cameras and lasers, to collect information. This proliferation of sensors demands much larger software programs and faster processing speeds. Renesas designed the RH850/P1x-C Series with large memory capacity and a powerful CPU. Offering up to 8MB Flash, up to 960KB global RAM, and operating speeds as fast as 240MHz, the new MCUs deliver the advanced functionality and performance needed to support these requirements. Networks: Communication networks are the lifeblood of the connected vehicle, linking driver assistance-related systems as well as other systems that interact with driver assistance systems and implementing cooperative control based on the data from the sensors. The RH850/P1x-C Series features a full array of communication functions, including Ethernet, in addition to CAN, LIN, CSI, and FlexRay. This allows the implementation of sensor fusion or complex control of chassis systems, using data obtained from a variety of sensing systems via a gateway function or vehicle network. Pricing and availability: Based on Renesas' 40-nanometer (nm) process, the RH850/P1x-C Series features the RH850/P1H-C and RH850/P1M-C group of MCUs. Samples of the RH850/P1x-C MCUs are scheduled to be available from February 2015, and the emulator device will be priced at $1,000 per unit. Mass production is scheduled to begin in September 2016 and is expected to reach a scale of 2,000,000 units per month in January 2020.

Renesas Electronics Corporation Collaborates with Tuxera Inc. on R-Car SoC Series

Tuxera Inc. announced an ongoing cooperation with Renesas Electronics Corporation to address the growing demand for advanced in-vehicle infotainment systems (IVI). As part of the active collaboration, Tuxera has also joined the Renesas R-Car consortium that advances Renesas R-Car SoC series. Renesas' extensive product lineup makes it possible to implement a broad range of solutions for cutting-edge features such as 3D graphic capabilities along with audio, video and image recognition and processing.

Renesas Electronics to Shed 1,800 Jobs Through Voluntary Retirement

Renesas Electronics Corp. announced that it will shed some 1,800 employees through voluntary redundancy at the end of January 2015 in line with planned facility consolidation. The company will consolidate its 11 semiconductor design and development centers in six prefectures in Japan into four in three prefectures--Gunma, Aichi and Tokyo--in stages from February 2015. Under the early retirement program, Renesas will solicit applicants in December this year. The program will target employees aged 35 or over.

Renesas Electronics Corporation Reports Consolidated Earnings Results for the Second Quarter and Six Months Ended September 30, 2014; Provides Earnings Guidance for the nine months ending December 30, 2014

Renesas Electronics Corporation reported consolidated earnings results for the second quarter and six months ended September 30, 2014. For the quarter, the company reported net sales of JPY 207.7 billion; operating income was JPY 23.5 billion; ordinary income was JPY 23.8 billion; net income was JPY 13.9 billion. Capital expenditures were JPY 6.7 billion.        For the six months, net sales were JPY 416,928 million against JPY 416,866 million a year ago. Operating income was JPY 50,526 million against JPY 20,688 million a year ago. Ordinary income was JPY 49,094 million against JPY 13,910 million a year ago. Net income was JPY 35,118 million or JPY 21.07 per diluted share against net loss of JPY 12,810 million or JPY 30.22 per diluted share a year ago. For the nine months ending December 30, 2014, the company expects net sales of JPY 595,900 million; operating income of JPY 63,500 million; ordinary income of JPY 60,100 million; net income of JPY 46,100 million or JPY 27.65 per share.


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