Last $56.27 USD
Change Today +0.97 / 1.75%
Volume 1.5M
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As of 8:04 PM 10/24/14 All times are local (Market data is delayed by at least 15 minutes).

te connectivity ltd (TEL) Key Developments

TE Connectivity to Introduce its Latest Addition to the Rapid Fiber Multi-Dwelling Unit (MDU) Portfolio

TE Connectivity to introduce its latest addition to the Rapid Fiber multi-dwelling unit (MDU) portfolio, the Rapid Fiber faceplate, at the SCTE Cable-Tec Expo, held September 23-25 at the Denver Convention Center, in Denver, Colorado. The Rapid Fiber faceplate provides a full plug-and-play method for installing fiber inside the living unit, which significantly reduces customers' installation time, costs associated with site survey inspections, and ordering requirements for custom cable lengths. Utilizing TE's RapidReel fiber cable spool, the Rapid Fiber faceplate can store up to 30 meters of 1.2mm microcable inside its low-profile wall outlet. The cable terminates to a low-loss SC connector with a pulling eye solution, which allows the installer to pull the cable through a hallway conduit for a fast, plug-and-play connection to the fiber distribution terminal. TE's Rapid Fiber MDU portfolio incorporates innovative technologies such as the RapidReel fiber cable spool, low loss MPO connector, and small form factor microcable to simplify and speed fiber installation requirements while ensuring optimal network performance. A typical Rapid Fiber MDU architecture consists of an indoor fiber distributing hub (FDH) on the lower level, a Rapid Fiber distribution terminal (or mini Rapid Fiber distribution terminal) on each floor of the building, and the Rapid Fiber faceplate inside the living unit. For installing single optical fiber within the living units to the customer equipment, installers can leverage TE's thermal adhesive coated (TAC) fiber system. The TAC fiber system uses a unique handheld fiber tool and 900 micron microcable with integrated adhesive to quickly and easily install fiber around baseboards, windows and trim work.

TE Connectivity Showcases Advanced Mobile Network Solutions at CTIA 2014

TE Connectivity (TE) announced that it will be showcasing a range of advanced mobile network solutions at CTIA's Super Mobility Week, to be held September 9-11 at the Sands Convention Center in Las Vegas, Nevada. At booth #3438, TE will be exhibiting these innovations that facilitate mobile network installation and reduce the time and cost of deployments: FlexWave active integration panel (AIP) -- an integrated base transceiver station (BTS) interface solution that takes the guesswork and expense out of system commissioning and maintenance. FlexWave AIP provides a simple, compact interface that enables BTS signal splitting and combining, automatic power leveling, and remote and local monitoring without passive intermediation (PIM) issues. CPRI digital interface unit (CDIU) -- a pre-integrated solution that leverages the Common Public Radio Interface (CPRI) for base station connectivity. It removes the need for RF processing and attenuation panels at the distributed antenna system (DAS) head-end, which can reduce the physical equipment required by more than 50% and reduce cost of materials by up to 40%. Powered fiber cable -- a new hybrid fiber cable design that integrates power with fiber connectivity. This cable enables installers to deploy DAS antennas where they need to be in order to deliver the best network capacity and coverage, without having to worry about the presence or expense of local power at the antenna site.

TE Connectivity Ltd. Presents at Citigroup Industrial Conference 2014, Sep-23-2014 11:00 AM

TE Connectivity Ltd. Presents at Citigroup Industrial Conference 2014, Sep-23-2014 11:00 AM. Venue: Intercontinental Hotel, Boston, Massachusetts, United States. Speakers: Robert W. Hau, Chief Financial Officer and Executive Vice President.

TE Connectivity Upgrades Mobile Networks for 4G and Beyond

TE Connectivity announced that TE's FlexWave Prism and InterReach Spectrum distributed antenna systems (DAS) are now upgraded for 4G services, allowing customers currently using 2G and 3G service to deliver more capacity in their networks. Using techniques such as multiple input/multiple output (MIMO), resectorization, and adding new frequencies, including 700 MHz and 2,100 MHz AWS, TE is driving new levels of capacity and service in stadiums, hospitality venues, subways, major enterprises and universities worldwide. TE's DAS solutions are ideal for 4G upgrades because they use technology-agnostic electronics to distribute mobile signals. This means that mobile operators and venue owners can simply add a new base station interface to the DAS head-end and that signal is automatically distributed to remote antennas placed around the property. Venues offering MIMO service can upgrade by adding a base station for the second MIMO path and a second antenna at each location to deliver the service. Creating redundancy and optimizing capacity does not require an overlay system with additional cabling and DAS electronics. MIMO is proving to be a popular upgrade in high-density user venues because it doubles network capacity and provides a high-performance foundation for future upgrades such as 5G. Venues in the U.S. adding MIMO to their networks with TE equipment include: FedEx Field, Sports Authority Field, Target Field, Austin and Anaheim Convention Centers, Dow Chemical, UCLA, Purdue University, and hospitality venues such as MGM's Las Vegas resorts, the New York Hilton, the New York Palace Hotel, Palisades Mall and Walt Disney World.

TE Connectivity Ltd. Announces Fiscal 2014 Fourth Quarter Dividend, Payable on September 12, 2014

TE Connectivity Ltd. announced that the $0.29 per share quarterly dividend for the fourth fiscal quarter of 2014 will be payable on September 12, 2014, to shareholders of record at the close of business on August 29, 2014. The dividend was approved by shareholders at the company's annual general meeting held on March 4, 2014.

 

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TEL

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Valuation TEL Industry Range
Price/Earnings 15.6x
Price/Sales 1.7x
Price/Book 2.6x
Price/Cash Flow 15.3x
TEV/Sales 1.3x
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