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Executive Profile*

Lin Tzumu

Senior Vice President of R&D Engineering and Director, VIA Technologies Inc.
AgeTotal Calculated CompensationThis person is connected to 11 board members in 1 different organizations across 1 different industries.

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Background*

Lin TzuMu serves as a Senior Vice President of R&D Engineering of VIA Technologies, Inc. and has been its Director since February 1995. Dr. TzuMu is Co-founder and Vice President of Design Technology of Symphony Laboratories, Director of Engineering at GS Technology in charge of all IC design effort including ASIC, full custom implementation as well as analog and digital technology, Design Manager for Silicon Compiler Systems, a key contributor to the engineering success ...

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Corporate Headquarters*

531, Zhongzheng Road
New Taipei City, -- 231

Taiwan

Phone: 886 2 2218 5452
Fax: 886 2 2218 5453

Board Members Memberships*

1995-Present
Senior Vice President of R&D Engineering and Director

Education*

PhD
California Institute of Technology
Master's Degree
California Institute of Technology

Other Affiliations*

Annual Compensation*

There is no Annual Compensation data available.

Stock Options*

There is no Stock Options data available.

Total Compensation*

There is no Total Compensation data available.
*Data is at least as current as the most recent Definitive Proxy.
 

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COMPETITOR COMPENSATION

NamePosition/
Company
Compensation
Mark S. Thompson Chairman and Chief Executive Officer
Fairchild Semiconductor International Inc.
$769.2K
Ronald D. Black Ph.D.Chief Executive Officer, President and Director
Rambus Inc.
$515.0K
Oleg Khaykin Chief Executive Officer, President and Executive Director
International Rectifier Corporation
$778.8K
Gerald Paul Chief Executive Officer, President, Director and Member of Executive Committee
Vishay Intertechnology Inc.
$1.1M
Behrooz Abdi Chief Executive Officer, President and Director
InvenSense, Inc.
$400.0K
Compensation as of Fiscal Year 2013.

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