September 22, 2014 6:38 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Deca Technologies Inc.

Company Overview

Deca Technologies Inc. operates as a subsidiary of Cypress Semiconductor Corporation.

7855 South River Parkway

Suite 111

Tempe, AZ 85284

United States

Phone:

480-345-9895

Key Executives for Deca Technologies Inc.

Chief Executive Officer and Director
Age: 51
Vice President of Operations and Managing Director of Philippines Operations
Vice President of Sales and Marketing
Compensation as of Fiscal Year 2014.

Deca Technologies Inc. Key Developments

Deca Technologies Inc. Announces Management Changes

Effective May 15, 2013, Christopher Seams, Cypress Semiconductor Corporation's Executive Vice President of Sales and Marketing, was appointed as the Chief Executive Officer of Deca Technologies Inc. Mr. Seams was also appointed to serve on the company's Board of Directors. Tim Olson, the former CEO of the company has assumed the role of Chief Technology Officer and will continue to serve on the company's Board of Directors. Gary Saunders, Cypress's Senior Vice President of Worldwide Sales will assume the majority of Mr. Seams' responsibilities and report directly to the company CEO, T.J. Rodgers.

Deca Technologies Inc. Unveils M-Series(TM) CSP with Adaptive Patterning

Deca Technologies announced the introduction of the new M-Series(TM) CSP product line featuring Adaptive Patterning(TM). M-Series is a rugged, fully molded packaging technology that provides popular ball grid array (BGA) style formats while eliminating the need for laminate substrates. Adaptive Patterning is a technology that dynamically creates and implements a unique design for each device during the manufacturing process to adapt for the typical die shift associated with embedded device packaging. One year ago, Deca Technologies announced its unique wafer level processes, inspired by SunPower Corp., and the first technology application on wafer level chip scale packaging. Deca adds the M-Series platform of embedded die packaging as the second major product offering. M-Series offers semiconductor designers and system architects a high-performance, cost-effective, miniaturized packaging solution. Deca is currently sampling M-Series to a limited set of customers with broader availability planned for 2013.

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