July 23, 2014 12:44 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of Pac Tech - Packaging Technologies GmbH

Company Overview

Pac Tech - Packaging Technologies GmbH manufactures packaging equipment and provides wafer level bumping and packaging services for customers in Germany and internationally. It offers wafer bumping with electroless Ni/Au or Ni/Pd under-bump-metallization for wafer level solder bumping for FC or WLCSP, as well as Ni/Pd/Au for wire bonding; AOI, X-ray inspection, wafer-level RDL, wafer thinning, laser marking, wafer dicing, and tape and reel service; and sawing/dicing, redistribution, backside laser marking repassivation, backside laser marking, back grinding, backside metal deposition/coating, test, and wafer level component/capacitor/resistor assembly services. The company also provides plat...

Am Schlangenhorst 15 - 17

Nauen,  14641


Founded in 1995


49 3321 4495100


49 3321 44 95 110

Key Executives for Pac Tech - Packaging Technologies GmbH

Chief Executive Officer and President
President of Pac Tech USA Inc and Chief Technology Officer of Pac Tech USA Inc
Chief Technology Officer
Age: 57
Vice President of Global Sales & Marketing
Compensation as of Fiscal Year 2014.

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