December 25, 2014 7:46 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of Tensorcom, Inc.

Company Overview

Tensorcom, Inc. develops low-power wireless chips. Its low-power chipsets and modules target wireless products that are used in various consumer applications, which include smartphones, tablets, laptops, digital cameras, and storage devices. The company’s products are used in mobile, PC centric, and TV centric applications. Tensorcom, Inc. was incorporated in 2006 and is based in Carlsbad, California.

5900 Pasteur Court

Suite 105

Carlsbad, CA 92008

United States

Founded in 2006

Phone:

760-496-3264

Key Executives for Tensorcom, Inc.

Co-Founder
Age: 63
Co-Founder
Co-Founder
Chief Financial Officer
Age: 53
Technical Advisor
Compensation as of Fiscal Year 2014.

Tensorcom, Inc. Key Developments

Tensorcom, Inc. Announces Lowest Power 802.11ad Complete Solution

Tensorcom has announced availability of the lowest power, 802.11ad/WiGig compliant System in a Package (SiP), which includes an Green System on a Chip (GSoC(TM)) that implements the MAC and PHY as well as multiple 60 GHz antennas. The TC2522-Y is the first GSoC(TM) to meet the power and size requirements of mobile phones and tablets while providing > 2.5 Gb/s throughput. The TC2522-Y showcases company's 60 GHz radio design as well a novel MODEM and MAC implementation that delivers on the 802.11ad promise of low-power Gb/s data connectivity for mobile platforms. The company's TC2522-Y is designed for IEEE Std 802.11ad-2012(TM) and supports up to 2.5 Gb/s operation over all four 60 GHz channels. It has been designed to be the lowest cost, lowest power solution for integrating multi-gigabit wireless links in space and power constrained devices such as mobile phones and tablets. Key Features: Fabricated in TSMC 40 nm standard CMOS process; Peak power < 150 mW using 802.11ad compliant low power single carrier mode; 2.5 Gb/s data rate supports QHD/4K video streaming; Complete solution including antennas fully integrated in a single package; Low cost 17 mm x 11 mm x 0.5 mm module; Available in a novel end-fire antenna pattern suitable for placement in thin devices or with patch antenna for vertical mounting.

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Recent Private Companies Transactions

Type
Date
Target
Private Placement
April 11, 2014
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