Company Overview of SEMATECH, Inc.

SEMATECH, Inc. announced that William R. Rozich has assumed the role of chairman of the board of directors. Rozich, who previously was a member of the company's board, succeeds Michael R. Polcari, who served as chairman since November 2009. Rozich, who begins his new role July 1, most recently served as the director of semiconductor operations of IBM Corporation at the College of Nanoscale Science and Engineering in Albany, New York.

Morgan Advanced Materials plc announced that it has joined SEMATECH, Inc.'s International SEMATECH Manufacturing Initiative (ISMI), a program designed to improve semiconductor equipment manufacturing productivity, yield, and cost. Morgan Advanced Materials will help develop process variation solutions to improve availability and process control across 200 mm and 300 mm semiconductor manufacturing facilities, while allowing for forward-compatibility with 450 mm. As a member of SEMATECH's Manufacturing Technology Program, Morgan will collaborate with ISMI engineers to develop and introduce new material solutions that will help to significantly extend the life of chemical mechanical planarization (CMP) pads, CMP conditioners, as well as electrostatic chucks. The partnership will further the development of processing solutions for effective CMP processing, including pad conditioning, to eliminate legacy high-volume manufacturing issues, shorten pad break-in time, and extend pad life of soft-pad textures.

SEMATECH, Inc. announced that Cabot Microelectronics Corporation has joined its Front End Processes (FEP) program and will collaborate with SEMATECH to develop advanced solutions for emerging CMP applications. The goal of SEMATECH's FEP program is to enable novel materials, processes, structural modules and electrical and physical characterization methods to support the continued scaling of logic and memory applications.