July 29, 2014 3:29 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of SMART Modular Technologies (WWH), Inc.

Company Overview

SMART Modular Technologies (WWH), Inc. designs, manufactures, and supplies electronic subsystems to OEMs engaged in computer, industrial, networking, telecommunications, and aerospace and defense markets worldwide. The company’s products include DRAM memory flash-based storage modules; embedded flash-based products that comprise embedded USB, embedded SATA, iSATA, uSATA, and mini-IDE drives; and removable flash memory products. Its products are also used in various applications, including computing, gaming, HPC, printers, servers, and storage. SMART Modular Technologies (WWH), Inc. was formerly known as SMART Modular Technologies, Inc. and changed its name to SMART Modular Technologies (WWH)...

39870 Eureka Drive

Newark, CA 94560-4809

United States

Founded in 1988

1,223 Employees





Key Executives for SMART Modular Technologies (WWH), Inc.

Chief Executive Officer
Age: 56
Chief Financial Officer
Age: 54
Senior Vice President of Emerging Markets and President of Smart Brazil
Senior Vice President and General Manager of Memory Business Unit
Age: 54
Chief Legal and Chief Compliance Officer and Vice President
Age: 59
Compensation as of Fiscal Year 2014.

SMART Modular Technologies (WWH), Inc. Key Developments

SMART Modular Technologies, Inc. Unveils DDR3 8GB ULP Planar Mini-UDIMM

SMART Modular Technologies, Inc. expanded its lineup of DDR3 small modules with 8GB ultra low profile, or ULP, Planar Mini-UDIMM. With its innovative design, SMART has doubled the number of DRAM placements to 18 on its ULP Planar Mini-DIMM which allows the use of mainstream cost-effective 4Gb DRAMs. The result is a high density solution contained in a small package effectively lowering the overall cost per module GB. Planar technology utilizes a PCB board that does not incorporate any DRAM stacking, dual die DRAM packages or a dual PCB structure. By comparison, industry standard VLP Mini-DIMMs have a maximum of nine DRAM placements. To achieve an 8GB density in a VLP form factor requires the use of DDP (dual die package) DRAMs, stacked DRAMs or 8Gb DDR3 monolithic DRAMs all of which add cost. The Mini-UDIMM is one of the industry's most common module form factor used in networking, telecom, and industrial applications, and SMART's DDR3 Mini-DIMMs provide a number of key benefits to OEMs. These include ECC for applications processing data, applications needing extra power and ground pins for more robustness compared to SO-DIMMs, applications needing high density pluggable memory in small, height-constrained environments, and ruggedized applications with the use of latching Mini-DIMM sockets. Now OEMs can have all of these benefits at a reduced cost with SMART's ULP Planar Mini-UDIMM.

SMART Modular Technologies, Inc. Announces High Performance DDR4 DRAM Module Support for Server, Storage and Networking Applications

SMART Modular Technologies, Inc. announced the first products in its DDR4 DRAM module portfolio. SMART's initial lineup of DDR4-2133 modules are loaded with technology advancements inherent to the DDR4 platform. Those advancements include power efficiencies, faster speeds and higher densities, all key benefits for next generation server, storage and networking applications. Designed in RDIMM, VLP RDIMM and SODIMM form factors, SMART's DDR4-2133 modules operate at 1.2 V compared to that of DDR3 modules which run at 1.35 or 1.5 V. That equates up to a 20% improvement in power consumption which can be meaningful in data centers or other large scale applications. Several DDR4 enhancements including CRC (Cyclic Redundancy Check) have been made to assure higher reliability in systems. In addition, SMART will be extending its Enterprise Memory service, the industry's most rigorous module testing process, into DDR4 to help OEMs maintain the possible levels of product quality and reliability.

SMART Modular Technologies, Inc. Unveils New XR-DIMM Small Form Factor DDR3 Module

SMART Modular Technologies, Inc. has unveiled its new XR-DIMM small form factor DDR3 module, designed for ruggedized single board computing, or SBC, applications. SMART's XR-DIMM solves the traditional space-constraint issue for Advanced Memory Card (AMC) form factor SBC's, where the clips from the horizontally mounted SO-DIMM's socket violate the "keep-out" areas of the card and interfere with the system chassis when the AMC card is removed. The XR-DIMM solves this issue by using a low profile, snap-down mezzanine connector with no clips. In addition, SMART's XR-DIMM form factor provides a ruggedized attach method and features improved signal integrity ideal for AMC cards, as well as ATCA, PCIe, and COMe embedded computing applications. The 240-pin module conforms to standards established by the Small Form Factor Special Interest Group (SFF-SIG) to provide a perfect-fit solution for telecom, networking and industrial computing applications. SMART's DDR3-1600 XR-DIMM is offered in 2GB, 4GB and 8GB densities with ECC. Other options offered include low power and industrial temperature operation.

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