December 25, 2014 8:47 AM ET

Electronic Equipment, Instruments and Components

Company Overview of Schott AG

Company Overview

SCHOTT AG, together with its subsidiaries, develops and manufactures specialty glasses, special materials, components, and systems in Germany and internationally. It operates through three segments: Precision Materials, Optical Industries, and Home Appliances. The company offers glasses, special materials, and components for optics, lithography, astronomy, opto-electronics, architecture, life sciences, and research applications; architectural glasses for exterior and interior applications; and receivers for use as components for concentrated solar power plants. It also provides hermetic housings and other components for electronic packaging; lighting and imaging systems for use in architectu...

Hattenbergstrasse 10

Mainz,  55122


Founded in 1884

15,444 Employees


49 6131 66 0


49 6131 66 2000

Key Executives for Schott AG

Executive Vice President and General Executive
Age: 58
Vice Chairman of Supervisory Board
Vice President of Services - Mainz
General Executive and Member of The Corporate Management Committee
General Executive
Compensation as of Fiscal Year 2014.

Schott AG Key Developments

SCHOTT Announces Launch of HermeS Wafers

SCHOTT AG has announced the launch of HermeS wafers with hermetically sealed solid 'Through Glass Vias', or TGV. HermeS glass substrates enable fully gastight and therefore long-term robust enclosures for MEMS devices. The fine pitched vias allow the reliable conduction of electrical signals and power into and out of the MEMS device. Since HermeS glass can be placed directly under the silicon MEMS, it makes miniaturized, fully hermetic 3D Wafer Level Chip Size Packaging (WLCSP) possible. HermeS wafer provides advantages in particular for MEMS devices used in industrial, medical and radio-frequency applications. MEMS-powered devices and sensors are often exposed to extremely harsh environments, pressure sensors in corrosive industrial production lines. Nevertheless they must function perfectly over long periods of time. The reliability and performance of the MEMS device depends on the long-term robustness of the MEMS packaging technology. SCHOTT's HermeS solution based on 'Through Glass Vias' leads to several customer advantages over other technologies such as 'Through Silicon Vias' or hermetic ceramic packaging. The superior material characteristics of glass compared to silicon or ceramics are the reason for this. First, due to the higher mechanical, thermal and chemical resistance of glass, the packaging is especially reliable, leading to a long-term performance of the MEMS device. Second, the low dielectric constant of glass and the possibility to use highly conductive via materials, HermeS wafer packaging also offers excellent radio-frequency (RF) performance. And, third, the optical transparency of the glass wafer enables better processing and quality control during the production process of a MEMS device. When used in industrial hermetic MEMS sensors, HermeS glass wafers enable long-term, reliable and extremely rugged packaging of industrial sensors. Equipped with SCHOTT's product, medical electronics can be packaged robustly to withstand body fluids and sterilization cycles over long periods of time. For RF MEMS, HermeS wafers provide superior RF properties through absolute hermeticity in an extremely miniaturized design. The use of SCHOTT's HermeS Through Glass Via substrates also enables the miniaturization of MEMS-powered devices, a reduction in package die size and a more compact design. The foot print can be reduced by up to 80% compared to a conventional ceramic package. SCHOTT offers HermeS TGV substrates made from three proprietary glass types: BOROFLOAT 33 floated borosilicate glass, AF 32 eco alkali-free flat glass and D 263T eco borosilicate glass. 130 years of SCHOTT expertise in the area of special purpose glass and 70 years of experience in the domain of electronic packaging flow into the development and production of the company's new products.

SCHOTT Announces POWERAMIC, Glass-Ceramics: a New Class of Dielectrics for High Voltage Capacitors

SCHOTT has developed a new dielectric material. POWERAMIC™ is a family of highly homogenous, pore-free glass-ceramics. Providing very high energy storage density, these materials show excellent dielectric properties even at elevated temperatures. In high voltage applications this allows for smaller, lighter weight passive components such as capacitors to deliver a more powerful performance. SCHOTT will introduce this innovation at IEEEs 2014 International Power Modulator and High Voltage Conference (IPMHVC) in Santa Fe, New Mexico from June 1 to 4 at Booth 26. SCHOTT POWERAMIC™ Glass-Ceramics: A New Class of Dielectrics for High Voltage Capacitors Glass-ceramics as dielectrics in capacitors provide high energy storage density for an extended temperature range POWERAMIC™ glass-ceramic is supplied as a qualified semi-finished product for the production of capacitors, upon request also in metallized form. It can be used for all commercially available capacitor designs, e.g. doorknob/hockey puck capacitors, SLCs (single layer capacitors), SMD (surface mount device) capacitors, as well as in custom designs to individual customer specifications.

Schoot AG Appoints Frank Heinricht as Chairman of the Board of Management

The supervisory board of Schoot AG appointed Frank Heinricht to the position of its new chairman of the board of management in its meeting on Feb. 27. Heinricht is currently Chairman of the Board of Management of Heraeus Holding GmbH. He will take office on June 1.

Recent Private Companies Transactions

December 5, 2014
Schott Moritex Corporation

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