September 23, 2014 7:54 PM ET

Metals and Mining

Company Overview of Indium Corporation

Company Overview

Indium Corporation refines, produces, supplies, and fabricates indium and indium chemicals to the global electronics, semiconductor, solar, thin-film, and thermal management markets. It offers solder pastes, solder preforms, solder spheres, solder wires, solder ribbons, and solder foils; and assembly products for medical devices and electronics, circuit board assembly materials, connector pin soldering, engineered solders, gold-based assembly materials, halogen-free soldering materials, low temperature solders, Pb-free materials, semiconductor packaging and assembly materials, solder fabrications, solder fortification, solder research kits, fusible alloys, indium compounds, research kits, so...

34 Robinson Road

Clinton, NY 13323

United States

Founded in 1934

Phone:

315-853-4900

Fax:

315-853-1000

Key Executives for Indium Corporation

Chief Financial Officer
Vice President of Technical Support Metals and Chemicals
Managing Director of European Operations
Vice President of Technology
Director of Solar Products
Compensation as of Fiscal Year 2014.

Indium Corporation Key Developments

Indium Corporation Announces New EZ-Pour(TM) Gallium Trichloride

Indium Corporation announces the release of new product called EZ-Pour™ Gallium Trichloride (GaCl3). Gallium trichloride is a unique material that is sometimes difficult to use because it is a solid at room temperature and transfer from one container to the next requires heating. Additionally, traditional gallium trichloride powder typically forms clumps and sticks together. Both of these forms currently inhibit efficient and consistent materials transfer between vessels and processing equipment. EZ-Pour™ Gallium Trichloride’s unique granulated form solves this challenge by eliminating clumping and enabling fast, efficient, safe, and accurate transfer.

Indium Corporation Announces New Solder Paste Technology

Indium Corporation announced a new solder paste technology. BiAgX™ is a melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers. BiAgX™ is for small, low-voltage QFN packages that are used in portable electronics (smartphone/tablet), automotive electronics, and industrial applications. It excels in high temperature environments in excess of 150°C. It requires minimal process adjustments and no capital expenditures for customers converting from a standard high Pb-containing solder paste-based process. BiAgX™ addresses both customer demands and potential legislative changes that eliminate lead from high-melting die-attach applications. It is both Pb-free and Sb-free (lead and antimony) and does not contain costly specialty materials, such as nanosilver or sintering aids. BiAgX™ reflows, solders, wets, and solidifies just like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes.

Indium Corp Presents at Metal Bulletin's Minor Metals Conference USA, Sep-27-2013 11:30 AM

Indium Corp Presents at Metal Bulletin's Minor Metals Conference USA, Sep-27-2013 11:30 AM. Venue: The Platinum Hotel, 211 E. Flamingo Road, Las Vegas, NV 89169, United States. Speakers: Malcolm Harrower, Sales Manager, Metal Compounds and Thin Film Materials.

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