D2S, Inc. develops and supplies a computational design platform to maximize existing eBeam technology to reduce mask costs for low and high volume applications. It offers TrueMask MDP, a full-chip model-based mask data preparation solution that offers an automated full-chip mask data preparation for various complex masks, including Manhattanized, curvilinear, and ideal inverse lithography technology mask shapes to reduce eBeam shot count to cut mask write times, while improving the quality of the eventual wafers through built-in mask process correction. It also offers TrueMask DS, a mask-wafer double simulation platform for R&D exploration, bit-cell design, hot-spot analysis, and mask-defect...
4040 Moorpark Avenue
San Jose, CA 95117
Founded in 2007
Linyong Pang Joins D2S as Chief Product Officer and Executive Vice President
May 12 14
D2S announced that Dr. Linyong (Leo) Pang, a semiconductor industry luminary and former senior executive at Luminescent Technologies, has joined the company as chief product officer and executive vice president. With more than 15 years of software, semiconductor and electronic design automation (EDA) experience, Dr. Pang will drive product development at D2S as the company plans to expand its computational design offerings for advanced semiconductor and photomask manufacturing.
D2S, Inc. Unveils TrueMask(TM) MDP
Sep 11 12
D2S, Inc. unveiled TrueMask(TM) MDP--the model-based mask data preparation (MB-MDP) solution to offer fully automated, full-chip mask data preparation for complex photomasks with Manhattanized, curvilinear and ideal inverse lithography technology (ILT) shapes within practical, cost-effective write-times. Developed to address complex mask designs at 20-nm-and-below process nodes, TrueMask MDP reduces eBeam shot count to cut mask write time by 20 to 30% or more for these mask designs, while improving the quality of the wafer produced through built-in mask process correction (MPC). D2S TrueMask MDP enables fast and accurate full-chip modeling of complex mask shapes, including ideal ILT shapes, for both 193-nm immersion (193i) and EUV masks. Being simulation-based, TrueMask MDP takes advantage of overlapping variable shaped beam (VSB) shots, each with its own dose modulation, to write the desired mask shape more accurately and with fewer shots. Built to run on the graphics processing unit (GPU)-accelerated D2S Computational Design Platform, TrueMask MDP provides a seamless flow for simulating, preparing and verifying mask writer formats and instructions. For complex Manhattan shapes, TrueMask MDP reduces mask write times by 20 to 30% or more compared to conventional fracturing. In addition, the resulting masks have better CD linearity and better CDU, particularly for small shapes, due to the built-in model-based MPC. For ideal ILT (curvilinear) shapes, which are impractical with conventional fracturing, TrueMask MDP reduces mask write times by more than 30% even when compared to Manhattanized versions of the ILT shapes. In addition, ideal ILT masks written with TrueMask MDP produce significantly higher quality wafers compared to those produced by the Manhattanized ILT masks written with conventional fracturing solutions. Embedded in TrueMask MDP is D2S TrueModel(TM) technology, which includes a proprietary test chip designed to extract overlapping and dose modulation effects, and an automated model calibration engine. Corner-rounding models for masks that are bundled into lithography models found in traditional MPC solutions are no longer sufficient to model mask effects. Unlike these approaches, TrueModel technology models each mask shape in its own unique full-chip context--enabling TrueMask MDP to produce masks of a higher quality.