October 23, 2014 12:42 PM ET

Semiconductors and Semiconductor Equipment

Company Overview of Open-Silicon, Inc.

Company Overview

Open-Silicon, Inc. designs and manufactures semiconductors. The company focuses on SoC realization for traditional ASIC, develop-to-spec, and derivative integrated circuits. It offers SoC architecture, system design, physical design, IP, software, and semiconductor manufacturing services; and OpenMODEL, an ASIC development process. The company was founded in 2003 and is headquartered in Milpitas, California with additional offices in Eau Claire, Wisconsin; Raleigh, North Carolina; Milpitas, California; and Bengaluru and Pune, India.

490 North McCarthy Boulevard

Suite 220

Milpitas, CA 95035

United States

Founded in 2003

Phone:

408-240-5700

Fax:

408-240-5701

Key Executives for Open-Silicon, Inc.

Senior Vice President of Finance
Chief Operating Officer and Managing Director of India Operations
Vice President of Operations & Technology Development
General Manager
Compensation as of Fiscal Year 2014.

Open-Silicon, Inc. Key Developments

Open-Silicon Announces 28Gbps Serializer/Deserializer

Open-Silicon announced a 28Gbps Serializer/Deserializer (SerDes) evaluation platform for ASIC development that will enable the rapid deployment of chips and systems for 100G networks. The platform includes a full board with packaged 28nm test chip, software and characterization data. The chip integrates a 28Gbps SerDes quad macro, using physical layer (PHY) IP from Semtech, and meets the compliance needs of the CEI-28G-VSR, CEI-25-LR and CEI-28G-SR specifications.

Open-Silicon Establishes High-Speed SerDes Technology Center of Excellence

Open-Silicon, Inc. announced it has established a SerDes Technology Center of Excellence (TCoE) to ensure rapid, cost-effective design and production of ASICs integrating high-speed serial technologies. The SerDes TCoE will enable new ASIC products with capabilities such as PCI Express (PCIe Gen 1/2/3/4), SATA, Hybrid Memory Cube (HMC), Interlaken and networking up to 100G. The TCoE provides access to unparalleled front-end and back-end design capabilities, IP integration, and packaging and test services - all intended to improve product time-to-market and quality. Open-Silicon applies its unique, high-speed serial design expertise to ensure the successful delivery of ASICs that will drive a new generation of high-speed networking equipment and Internet of Things (IoT) appliances.

Xilinx, Inc. and Open-Silicon, Inc. Announces Hybrid Memory Cube Controller IP for Xilinx Virtex(R)-7 FPGAs

Xilinx, Inc. and Open-Silicon, Inc. announced Hybrid Memory Cube (HMC) controller IP for Xilinx Virtex(R)-7 FPGAs. The high-performance nature of Virtex-7 FPGAs enables system developers to take advantage of the ultra-high memory bandwidth of the Hybrid Memory Cube and utilize the host-side IP to decrease time to market while providing over 1 Tb/s of serial bandwidth. Hybrid Memory Cube is a high performance memory solution that delivers unprecedented levels of bandwidth, power efficiency and reliability for networking and computing systems. The availability of new host-side HMC Controller IP furthers the widespread adoption of this revolutionary technology. The Open-Silicon HMC Controller IP offers a seamless interface to HMC. The high-performance controller offers an ultra-low latency core coupled with a flexible user interface. Optimized for Xilinx Virtex-7 FPGA implementation, the IP supports HMC links operating at 12.5 Gb/s per lane. The HMC controller has been tested on Xilinx Virtex-7 FPGAs and, along with the accompanying software stack, allows for the quick integration and evaluation of the HMC technology and performance testing of the HMC links.

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