August 27, 2014 11:21 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Samsung Electronics Co. Ltd.

Company Overview

Samsung Electronics Co. Ltd., together with its subsidiaries, is engaged in consumer electronics, information technology and mobile communications, and device solutions businesses worldwide. The company offers various consumer products, such as mobile phones, tablets, televisions, Blu-rays, DVD players, home theaters, air track, Bluetooth speakers, and mini components; cameras and camcorders; home appliances comprising refrigerators, air conditioners, washing machines, microwave ovens, ovens, and dishwashers; PC/peripherals/printers, including tablet PC, notebooks, chrome devices, monitors, optical disc drive, and laser printer/multifunctions; memory and storage products, such as solid state...

129, Samsung-Ro

Yeongtong-Gu

Suwon,  443742

South Korea

Founded in 1938

Phone:

82 3 1200 1114

Fax:

82 3 1200 7538

Key Executives for Samsung Electronics Co. Ltd.

Vice Chairman
Age: 62
Total Annual Compensation: $3.8B
Chief Executive Officer
Total Annual Compensation: $2.8B
Chief Executive Officer
Total Annual Compensation: $2.7B
President
Age: 59
Total Annual Compensation: $2.1B
Head of Corporate Strategy
Age: 63
Total Annual Compensation: $3.9B
Compensation as of Fiscal Year 2013.

Samsung Electronics Co. Ltd. Key Developments

Samsung Electronics, Ltd. Starts Mass Producing 3D TSV Technology Based DDR4 Modules for Enterprise Servers

Samsung Electronics Ltd. announced that it has started mass producing the first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) through silicon via (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise servers and cloud-based applications, as well as further diversification of data center solutions. The new RDIMMs include 36 DDR4 DRAM chips, each of which consists of four 4-gigabit (Gb) DDR4 DRAM dies. The low-power chips are manufactured using Samsung's most advanced 20-nanometer (nm) class process technology and 3D TSV package technology. Samsung's volume production of 3D TSV modules marks a new milestone in the history of memory technology, following the company's initial production of 3D Vertical NAND (V-NAND) flash memory last year. While 3D V-NAND technology embraces high-rise vertical structures of cell arrays inside a monolithic die, 3D TSV is an innovative packaging technology that vertically interconnects stacked dies. With its introduction of the new TSV modules, Samsung has further strengthened its technological leadership in the 3D memory era. To build a 3D TSV DRAM package, the DDR4 dies are ground down as thin as a few dozen micrometers, then pierced to contain hundreds of fine holes. They are vertically connected through electrodes that are passed through the holes. As a result, the new 64GB TSV module performs twice as fast as a 64GB module that uses wire bonding packaging, while consuming approximately half the power. In the future, Samsung believes that it will be able to stack more than four DDR4 dies using its 3D TSV technology, to create even higher density DRAM modules. This will accelerate expansion of the premium memory market, in line with an acceleration of the transition from DDR3 to DDR4 throughout the server market.

ParkerVision, Inc. Names Samsung Electronics Co. Ltd., Samsung Electronics America, Inc. and Samsung Telecommunications America, LLC as Additional Defendant in Patent Infringement Suit

ParkerVision, Inc. announced that it has amended its patent infringement complaint filed on May 1, 2014 against Qualcomm Incorporated, Qualcomm Atheros, Inc., HTC Corporation and HTC America, Inc. The amended complaint, filed in the United States District Court for the Middle District of Florida, names Samsung Electronics Co. Ltd., Samsung Electronics America, Inc. and Samsung Telecommunications America, LLC as additional defendants and furthermore adds four patents to the seven patents in the original complaint. The four additional patents relate to frequency translations and methods and systems for down-converting an electromagnetic signal. The original seven patents in this case relate to radio frequency up-conversion of electromagnetic signals, systems for control of multi-mode, multi-band communications, baseband innovations including control and system calibration, and wireless protocol conversion. ParkerVision is seeking unspecified monetary damages from the defendants as well as a permanent injunction. ParkerVision is also seeking a finding of willful infringement against Qualcomm based on its alleged prior knowledge of certain of the patents in this case.

Samsung, Rostelecom Launch Educational Tablet Package

Rostelecom, in cooperation with Samsung Electronics, has introduced a co-branded educational package based on the Samsung Tab 4 10.1 tablet. The solution was launched as part of the 'Electronic Future School' project. The tablet is focused on the needs of school-children in primary and secondary schools, as well as in pre-schools. The package includes electronic manuals, as well as other educational content.

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