Electronic Equipment, Instruments and Components
Company Overview of Rohm and Haas Electronic Materials LLC
Rohm and Haas Electronic Materials LLC develops and delivers material solutions and processes to the electronic and optoelectronic industries. It operates through four units: Circuit Board Technologies, CMP Technologies, Microelectronic Technologies, and Packaging and Finishing Technologies. The Circuit Board Technologies unit creates solutions for electronic markets by providing materials and fabrication services for the circuit board market, including metallization, imaging, embedded passives, and optoelectronics; and connector and industrial finishes, EMI shielding, plating on plastic, optopackaging, and tin finish for strip steel, as well as finishes for IC packaging, capacitors, and res...
455 Forest Street
Marlborough, MA 01752
Founded in 1957
Key Executives for Rohm and Haas Electronic Materials LLC
Chief Financial Officer and Vice President
Executive Vice President Global Sales & Marketing
Compensation as of Fiscal Year 2013.
Rohm and Haas Electronic Materials LLC Key Developments
Dow Launches Next-Generation CMP Polishing Pad Platform
Sep 5 12
Rohm and Haas Electronic Materials LLC (Dow Electronic Materials) introduced its new IKONIC(TM) polishing pad platform, bringing to market Dow's most advanced polishing pads for chemical mechanical planarization (CMP). The IKONIC(TM) platform offers a series of new pads designed to deliver the performance for the broadest range of CMP applications at or below the 28 nm technology node. Dow's IKONIC(TM) pad technology combines a range of hardness and porosity with a pad surface that is easy to condition. Dow's IKONIC(TM) pad platform is a family of products that deliver multiple benefits in copper, tungsten, ILD, STI and other polishing applications. Its formulations combine a unique set of chemistries with a range of hardness and porosity, creating pads that are easy to condition. IKONIC(TM) pads are designed to improve defectivity performance for higher wafer yields, with the potential for extended pad lifetime leading to greater tool uptime. These new CMP pads meet a range of removal rate targets for throughput gains, and selectivity requirements to address process needs. Select products from the IKONIC(TM) family can also improve planarization efficiency and wafer topography. These benefits make the IKONIC(TM) polishing pad platform ideal for a wide range of advanced polishing applications. Dow Electronic Materials' IKONIC(TM) pad platform sets a new benchmark for CMP, drawing on the company's expertise in materials science, polishing, manufacturing and high volume supply. These capabilities, combined with collaborative customer relationships, make Dow the global leader in CMP pads. IKONIC(TM) polishing pads are currently available for sampling, and commercialization is targeted for early 2013.
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