Semiconductors and Semiconductor Equipment
Company Overview of X-FAB Semiconductor Foundries AG
X-FAB Semiconductor Foundries AG operates as a foundry for analog and mixed-signal semiconductor applications. It manufactures silicon wafers for mixed-signal integrated circuits. The company manages product development flow and supply chain for its customer’s semiconductor products. It offers technical support, online support, technical documentation, design support, prototyping and manufacturing support solutions, outsourcing and process transfer management, and e-business services; and analog/mixed-signal reference kits for the adoption of constraint-driven design, mixed-signal simulation, floorplanning, schematic-driven layout, automated routing, and timing-driven digital block implement...
Founded in 1999
Key Executives for X-FAB Semiconductor Foundries AG
Chief Executive Officer and Chairman
Chief Executive Officer and Director
Compensation as of Fiscal Year 2013.
X-FAB Semiconductor Foundries AG Key Developments
X-FAB Silicon Foundries NV Introduces New Analog/Mixed-Signal Reference Kit for Rapid Adoption of Advanced Cadence Design Flows
Jun 27 13
X-FAB Silicon Foundries NV announced its new A/MS Reference Kit supporting advanced methodology for analog/mixed-signal design. The Kit enables rapid adoption of constraint-driven design, mixed-signal simulation, floorplanning, schematic-driven layout, automated routing, timing-driven digital block implementation and signoff. It is entirely based on the latest mixed-signal flow from Cadence Design Systems Inc., a leader in global design innovation. The Kit includes an OpenAccess PDK to enable mixed-signal designs for 180nm and other technologies, a reference design, flow scripts and detail documentation for easy setup and fast adoption. It demonstrates how advanced Cadence(R) tools integrated in the design flow help increase design productivity, shorten time to market, improve quality of silicon, and reduce the overall design costs. The A/MS Reference Kit covers a vast majority of Cadence design tools and flows, focusing on rapid analog prototyping and analog layout automation, full-chip A/MS simulation, analog-on-top mixed-signal implementation, automated custom routing, and digital block implementation. This comprehensive solution for achieving highest-quality A/MS designs offers full interoperability between the analog Virtuoso and Encounter Digital Implementation system, and consistent analog and digital implementation based on OpenAccess and mixed-signal-enabled PDK. Availability: the new A/MS Reference Kit is available from X-FAB now.
X-FAB Silicon Foundries NV Announces XT018 offering for 200V MOS capability
Nov 8 12
X-FAB Silicon Foundries NV announced its XT018 offering for 200V MOS capability at 180nm. Using the full dielectric isolation of this modular process allows blocks at different voltage levels to be integrated on a single chip instead of placed on different chips. It significantly reduces the number of required additional components on printed circuit boards, eliminates latch-up and provides built-in robustness against electromagnetic interference. The XT018 SOI technology is the only available foundry process at 180nm for applications requiring the 100V to 200V voltage range. It is ideal for consumer, medical, telecommunication infrastructure and industrial applications that need bidirectional isolation, such as PoE applications, ultrasound transmitter drivers, piezo actuators and capacitive-driven micromechanics. The new technology combines fully isolated MOS transistors for the high-voltage drain with a 180nm technology for 1.8V /5.0V I/O and up to 6 metal layers. Its unique process architecture, utilizing a super-junction architecture with patented dielectric HV termination for the MOS transistors, allows compact design with a Ron as low as 0.3 mm for 100V and 1.1 mm for 200V nMOS transistors. The HV MOS transistors are designed to have identical electrical parameters for both low- and high-side operation. The modular approach of the XT018 process includes a 5V-only module for analog-focused applications, and HVnmos and Hvpmos modules that can be selected separately. The technology is fully characterized for a temperature range of -40degC to 175degC. In addition to the HV transistors, the new XT018 technology offering provides a thick metal option to support high-current routing, isolated 10V MOS, basic junction diodes and bipolar transistors, medium- and high-ohmic poly resistors, and an area-efficient high-capacity MIM (2.2 to 6.6 fF/um(2)), as well as a high-voltage capacitor. The super-junction technology allows rectifying diodes with 20ns reverse recovery time, enabling rectifiers and bootstrap circuitry to be integrated efficiently on the chip rather than off-chip.
X-FAB Semiconductor Foundries AG and Anvo-Systems Dresden Cooperate to Provide High-Speed Non-Volatile Memory Solutions
Nov 6 12
X-FAB Semiconductor Foundries AG and Anvo-Systems Dresden announced a cooperative agreement to offer high-speed non-volatile memory solutions that combine SRAM, DRAM and SONOS FLASH technologies; the compact design results in a small silicon footprint that keeps device costs low. In this partnership, Anvo-Systems Dresden provides the IP and design expertise, and X-FAB provides the semiconductor manufacturing process, capacity and quality assurance. The new nvSRAM solutions are ideal for solutions requiring high reliability and security, such as for medical, communication, automotive, bio-technology and industrial control and metering applications. Anvo-Systems Dresden's novel nvSRAM approach offers multiple cost and energy-saving advantages compared to traditional Flash and EEPROM solutions. It combines the typical SRAM features with extremely robust, energy-efficient and cost-effective SONOS FLASH technology. The nvSRAM IP blocks come with unlimited and fast (20ns) read and write operation and a standard SRAM interface. A full parallel data backup up to 125Mb/s guarantees fast store operation. Because the energy for storage is gathered during the normal operation cycle, no additional customer control circuitry is needed. In addition, the compact design and small silicon footprint hold down device costs. To guarantee stable and reliable production of the nvSRAM solutions, X-FAB has installed a dedicated 0.18 micrometer manufacturing process on 8-inch wafers optimized for highly reliable memories based on SONOS architecture. The special memory solutions developed by Anvo-Systems Dresden survive -ray sterilization.Anvo-Systems Dresden, after introducing its serial nvSRAM product families earlier this year, recently released a new parallel 256k nvSRAM product family with 25ns access time, unlimited Read/Write cycles, multiple STORE options and unique security features.
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