July 22, 2014 5:33 AM ET

Semiconductors and Semiconductor Equipment

Company Overview of Shintec Co., Ltd.

Company Overview

Shintec Co., Ltd. develops and sells semiconductor package substrates. It offers ball grid array (BGA) substrates, chip on flexible printed circuits, and flexible printed circuit boards. The company also provides chip size/scale package semiconductor package; flip chip BGA to assemble a bare chip on substrate by flip chip method; and radio frequency module substrate package for micro radio frequency module, such as power amp, radio transceivers, and front-end. In addition, it offers materials for semiconductor package substrate that include slitting product for TAB tape, as well as polyimide films, adhesives, copper foils, solder resists, and spacers; precision tooling for film punching; for...

1-6-3 Higashida

Yahata Higashi-ku

Kitakyushu,  805-0071

Japan

Founded in 1999

Phone:

81 93 663 3988

Fax:

81 93 663 8788

Key Executives for Shintec Co., Ltd.

Chief Executive Officer
Compensation as of Fiscal Year 2014.

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