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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, and Europe. The company offers packages, such as flip-chip ball grid array (BGA), flip-chip CSP, advanced chip scale packages, and IC wirebonding packages; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire bonding solutions, as well as module assembly services, and interconnect materials. Its testing services comprise front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module SiP/discrete final testing services, memory final testing services, other test related services, and drop shipment services. The company also provides electronics manufacturing services for use in a range of end-use applications, such as computers, peripherals, communications, industrial applications, automotive electronics, and storage and server applications. It offers package and testing services for a range of products with end-use applications in the communications, computers, consumer electronics, industrial, and automotive sectors. The company was founded in 1984 and is based in Kaohsiung, Taiwan.

Founded in 1984

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advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Announces Unaudited Consolidated Net Revenues Results for the Month of November 2014

Advanced Semiconductor Engineering Inc. announced unaudited consolidated net revenues results for the month of November 2014. For the month, the company reported net revenues of TWD 25,250 million against TWD 21,974 million a year ago.

Advanced Semiconductor Engineering Inc. Announces Consolidated Unaudited Sales Results for the Month of October 2014

Advanced Semiconductor Engineering Inc. announced consolidated unaudited sales results for the month of October 2014. For the month, the company reported net revenues of TWD 26,522 million compared with TWD 20,763 million for the same period a year ago.

Advanced Semiconductor Engineering, Inc. Announces Unaudited Consolidated Earnings Results for the Third Quarter and Nine Months Ended September 30, 2014; Provides Earnings Guidance for the Fourth Quarter of 2014

Advanced Semiconductor Engineering Inc. announced unaudited consolidated earnings results for the third quarter and nine months ended September 30, 2014. For the quarter, total net revenues were TWD 66,632 million against TWD 56,748 million a year ago. Operating income was TWD 8,084 million against TWD 6,099 million a year ago. Income before tax was TWD 8,590 million against TWD 5,368 million a year ago. Income from continuing operations and before non-controlling interest were TWD 7,353 against TWD 4,546 million a year ago. Net income attributable to shareholders of the parent was TWD 7,205 million against TWD 4,430 million a year ago. Diluted earnings per share were TWD 0.82 against TWD 0.57 a year ago. Capital expenditures totaled TWD 430 million. For the nine months, total net revenues were TWD 179,947 million against TWD 155,698 million a year ago. Operating income was TWD 19,754 million against TWD 15,105 million a year ago. Income before tax was TWD 18,924 million against TWD 13,565 million a year ago. Income from continuing operations and before non-controlling interest were TWD 15,737 against TWD 10,481 million a year ago. Net income attributable to shareholders of the parent was TWD 15,737 million against TWD 10,481 million a year ago. Diluted earnings per share were TWD 1.98 against TWD 1.36 a year ago. The company expects consolidated gross margin to edge down, while consolidated operating margin to be flattish for the fourth quarter of 2014.

 

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2311

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Price/Earnings 14.8x
Price/Sales 1.2x
Price/Book 2.2x
Price/Cash Flow 14.1x
TEV/Sales 0.6x
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