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advanced semiconductor engr (2311) Details

Advanced Semiconductor Engineering, Inc. provides semiconductor packaging and testing services in the United States, Taiwan, Asia, and Europe. The company offers packages, such as flip-chip ball grid array (BGA), flip-chip CSP, advanced chip scale packages, and IC wirebonding packages; 3D chip packages; stacked die solutions in various package types, such as stacked die quad flat no-lead, hybrid BGAs containing stacked wire bond, and fc die; and copper wire bonding solutions, as well as module assembly services, and interconnect materials. Its testing services comprise front-end test engineering testing, wafer probing, logic/mixed-signal/RF/module SiP/discrete final testing services, memory final testing services, other test related services, and drop shipment services. The company also provides electronics manufacturing services for use in a range of end-use applications, such as computers, peripherals, communications, industrial applications, automotive electronics, and storage and server applications. It offers package and testing services for a range of products with end-use applications in the communications, computers, consumer electronics, industrial, and automotive sectors. The company was founded in 1984 and is based in Kaohsiung, Taiwan.

Founded in 1984

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advanced semiconductor engr (2311) Key Developments

Advanced Semiconductor Engineering Inc. Reports Unaudited Consolidated Earnings Results for the Month of August 2014

Advanced Semiconductor Engineering Inc. reported unaudited consolidated earnings results for the month of August 2014. For the month, the company reported net revenues of TWD 20,934 million against TWD 18,827 million for the same period in the last year.

Advanced Semiconductor Engineering Inc. Announces Unaudited Consolidated Revenue Results for the Month Ended August 2014

Advanced Semiconductor Engineering Inc. announced unaudited consolidated revenue results for the month ended August 2014. For the month, the company announced net revenues of TWD 20,934 million against TWD 18,827 million for the same month a year ago.

Advanced Semiconductor Engineering Inc. Presents at CLSA Investor Forum, Sep-17-2014

Advanced Semiconductor Engineering Inc. Presents at CLSA Investor Forum, Sep-17-2014 . Venue: Grand Hyatt, Hong Kong. Speakers: Joseph Su, Senior Manager.

 

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2311

Industry Average

Valuation 2311 Industry Range
Price/Earnings 16.3x
Price/Sales 1.2x
Price/Book 2.3x
Price/Cash Flow 16.1x
TEV/Sales 0.6x
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