Last CNY32.30 CNY
Change Today +0.56 / 1.76%
Volume 332.6K
002618 On Other Exchanges
Symbol
Exchange
Shenzhen
As of 8:44 PM 11/25/14 All times are local (Market data is delayed by at least 15 minutes).

shenzhen danbond technolog-a (002618) Snapshot

Open
CNY31.82
Previous Close
CNY31.74
Day High
CNY32.49
Day Low
CNY31.77
52 Week High
02/10/14 - CNY42.20
52 Week Low
04/28/14 - CNY26.66
Market Cap
5.9B
Average Volume 10 Days
1.4M
EPS TTM
CNY0.32
Shares Outstanding
182.6M
EX-Date
06/26/14
P/E TM
100.9x
Dividend
CNY0.03
Dividend Yield
0.09%
Current Stock Chart for SHENZHEN DANBOND TECHNOLOG-A (002618)

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shenzhen danbond technolog-a (002618) Details

Shenzhen Danbond Technology Co., Ltd. is engaged in the research, development, manufacture, and sale of flexible circuits and its materials in primarily in China. The company offers FCCL single and double sides substrates used in LCD monitors, LCD TVs, cameras, mobile phones, netbooks, e-books, cars, etc.; COF flexible encapsulation substrates; COF products used in LCD TVs, smart 3G phones and laptop computers, and other products with LCD display drivers; and FPC flexible circuits. It also provides encapsulation-related heat curing adhesive and micro adhesive glue films. Shenzhen Danbond Technology Co., Ltd. was founded in 2001 and is based in Shenzhen, China.

Founded in 2001

shenzhen danbond technolog-a (002618) Top Compensated Officers

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shenzhen danbond technolog-a (002618) Key Developments

Shenzhen Danbond Technology Co., Ltd. to Report Q3, 2014 Results on Oct 30, 2014

Shenzhen Danbond Technology Co., Ltd. announced that they will report Q3, 2014 results on Oct 30, 2014

Shenzhen Danbond Technology Co., Ltd., Special/Extraordinary Shareholders Meeting, Sep 23, 2014

Shenzhen Danbond Technology Co., Ltd., Special/Extraordinary Shareholders Meeting, Sep 23, 2014., at 14:30 China Standard Time. Agenda: To consider by-election of directors; and to consider resignation of supervisors and by-election of supervisors.

Shenzhen Danbond Technology Co., Ltd. to Report First Half, 2014 Results on Aug 28, 2014

Shenzhen Danbond Technology Co., Ltd. announced that they will report first half, 2014 results on Aug 28, 2014

 

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002618:CH CNY32.30 CNY +0.56

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002618

Industry Average

Valuation 002618 Industry Range
Price/Earnings 79.2x
Price/Sales 14.4x
Price/Book 3.7x
Price/Cash Flow 79.3x
TEV/Sales 12.3x
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