Last $2.64 USD
Change Today +0.0986 / 3.88%
Volume 57.5K
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aehr test systems (AEHR) Snapshot

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10/3/13 - $3.59
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aehr test systems (AEHR) Details

Aehr Test Systems designs, engineers, develops, manufactures, and sells test and burn-in equipment used in the semiconductor industry worldwide. The company’s systems are used to simultaneously perform parallel testing and burn-in of packaged integrated circuits (ICs), singulated bare die, or ICs still in wafer form. Its principal products include the Advanced Burn-in and Test System, a system to test and burn-in high-power logic and low-power ICs; FOX full wafer contact parallel test and burn-in system designed to make contact with various pads of a wafer simultaneously, which enable full wafer parallel test and burn-in; and MAX burn-in system for monitored burn-in of memory and logic devices. The company also provides the WaferPak full wafer contactor, a cartridge system that includes a full-wafer probe card for use in testing wafers in FOX systems; DiePak carrier, a reusable, temporary package, which enables IC manufacturers to perform final test and burn-in of bare die; and test fixtures that include burn-in boards for the ABTS parallel test and burn-in system, and the MAX monitored burn-in system. In addition, it provides customer service and support programs, including system installation, system repair, applications engineering support, spare parts inventories, customer training, and documentation. The company markets its products through a network of distributors and sales representatives to semiconductor manufacturers, semiconductor contract assemblers, electronics manufacturers, and burn-in and test service companies. Aehr Test Systems was founded in 1977 and is headquartered in Fremont, California.

72 Employees
Last Reported Date: 08/28/13
Founded in 1977

aehr test systems (AEHR) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $268.7K
Founder and Chairman
Total Annual Compensation: $179.0K
Chief Financial Officer, Principal Accounting...
Total Annual Compensation: $179.1K
President of Aehr Test Systems Japan K.K.
Total Annual Compensation: $167.4K
Vice President of Engineering
Total Annual Compensation: $206.3K
Compensation as of Fiscal Year 2013.

aehr test systems (AEHR) Key Developments

Aehr Test Systems Announces Follow-On Orders for FOX(TM) Capacity Additions

Aehr Test Systems announced that it has received follow-on orders for increased FOX-15 wafer level burn-in and test system and WaferPak full wafer contactor capacity from a leading communication equipment manufacturer that will increase the manufacturer's burn-in capacity by 250%. FOX systems, using Aehr Test WaferPak contactors, allow parallel testing of thousands of die on a wafer with only a single touchdown. Aehr Test's FOX family of products is focused on high reliability test needs and long-duration full wafer burn-in and test of products such as automotive ICs, memories and devices with embedded memories, including microcontrollers and smart card devices. The FOX-1 system offers high-throughput single-touchdown sort testing. The FOX-15 system has a capacity of up to 15 WaferPak single-touchdown full wafer contactors for burn-in and test of an integrated circuits. As each wafer contains thousands of ICs, the throughput and capacity of the systems are quite large and suitable for production as well as reliability qualification applications. With the increasing popularity of stacked and multi-die packaging, each of the die in the package must be highly reliable in order to ensure the high possible package part yields and to enable the multi-die package to meet the stringent reliability demands of automotive and enterprise server manufacturers. Aehr Test's FOX systems provide full wafer contact parallel test and burn-in solutions for the die before they are assembled into the package.

Aehr Test Systems Names David Fucci as Vice President of Operations and Manufacturing

Aehr Test Systems announced the appointment of David Fucci as vice president of operations and manufacturing, effective June 2, 2014. Mr. Fucci joins Aehr Test to oversee manufacturing operations and execution of the roll out and ramp of the company's new ABTS Advance Burn-in and Test systems and FOX wafer level test solutions. Prior to joining Aehr Test Systems, Mr. Fucci was Vice President of Manufacturing Operations/Vice President Quality and Compliance at DCG Systems.

Aehr Test Systems Announces ABTS(TM) System Shipments into China Market

Aehr Test Systems announced it has shipped ABTS Burn-in and Test Systems to two new customers in China, one to a Chinese semiconductor foundry to fill a previously announced order and the other to a Chinese government research institute. According to industry research firm TechNavio, the semiconductor market in China is forecast to grow at a CAGR of 24.4% over the period 2012-2016. The firm notes that one of the key factors contributing to this market growth is the globally increasing demand for smartphones and tablets, and their data also show that the semiconductor market in China has been witnessing large capital expenditures by global companies to set up a semiconductor manufacturing base in China. The ABTS family of products is based on a new hardware and software platform that is designed to address not only today's devices, but also future devices for many years to come. It can test and burn-in both logic and memory devices, including resources for high pin-count devices and configurations for high-power and low-power applications. The ABTS system can be configured with up to 72 burn-in boards with up to 320 I/O channels each and 32M of test vector memory per channel. The ABTS offers the option of high voltage Device Power Supplies configurable with programmable voltage ranges to 60 or 230 volts, which are needed for automotive and power-line applications. The ABTS system is optimized for use with the Sensata iSocket and VTR Thermal Management Technologies, which provide a scalable cost-effective solution using individual device temperature control for ICs up to 75 watts or more. Individual temperature control enables higher-power devices with a broad range of power dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device temperature. The ABTS system also uses N+1 redundancy technology and hot-swap capability for many key components in the system to maximize system uptime.


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