Last €5.59 EUR
Change Today +0.168 / 3.10%
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As of 1:34 PM 12/19/14 All times are local (Market data is delayed by at least 15 minutes).

amkor technology inc (AMK) Snapshot

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06/18/14 - €9.19
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amkor technology inc (AMK) Details

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer backgrinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, and copper clip interconnect technologies; and package carriers include leadframe, a sheet of metal on which a pattern of electrical connections has been cut, as well as substrate, a laminate of multiple layers of epoxy resin, woven glass fibers, and metal conductors. The company also provides semiconductor testing services, such as wafer testing or probe, and final test services; flip chip chip scale package products for a range of applications, such as wireless handsets and mobile consumer electronic devices; flip chip ball grid array products for various networking, storage, computing, and consumer applications; and flip chip molded BGA packages that enable thinner packaging and thermal performance. In addition, it offers leadframe packages that use wirebond or flip chip technology to interconnect a die to a leadframe package carrier in electronic devices and for low to medium pin count applications; substrate-based wirebond packages to connect a die to a substrate; micro-electro-mechanical systems packages; and system-in-package modules, which are used in mobile devices for components, such as fingerprint sensors, radio frequency controllers, power amplifiers, GPS modules, Bluetooth modules, digital basebands, and hard drive controllers. The company primarily serves integrated device manufacturers, fabless semiconductor companies, and contract foundries, as well as automotive and industrial markets. Amkor Technology, Inc. was founded in 1968 and is headquartered in Chandler, Arizona.

20,900 Employees
Last Reported Date: 02/28/14
Founded in 1968

amkor technology inc (AMK) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $422.5K
Chief Financial Officer and Executive Vice Pr...
Total Annual Compensation: $456.0K
Executive Vice President of Corporate Worldwi...
Total Annual Compensation: $500.0K
Chief Administrative Officer, Executive Vice ...
Total Annual Compensation: $580.0K
Executive Vice President of Global Sales & Ma...
Total Annual Compensation: $398.0K
Compensation as of Fiscal Year 2013.

amkor technology inc (AMK) Key Developments

Amkor Technology, Inc. Licenses Proprietary Copper Pillar Wafer Bump Technology to GLOBALFOUNDRIES

Amkor Technology, Inc. announced that it has granted GLOBALFOUNDRIES a non-exclusive license to its proprietary copper pillar wafer bump technology. The agreement provides for the transfer of Amkor’s copper pillar wafer bump technology to GLOBALFOUNDRIES and a license under Amkor’s intellectual property to enable GLOBALFOUNDRIES to bump wafers based on this technology. Amkor’s copper pillar wafer bump technology enables low profile and small area packaging, which is required for the mobile device market. Copper pillar technology supports 3D fine pitch memory interfaces and is utilized in 2.5D packaging where fine pitch multi-die interconnects can reduce system level costs and shorten time-to-market as compared to SoC platforms. In addition, Amkor’s copper pillar wafer bump technology supports substantial die-to-die bandwidth between memory and logic devices, greatly reduces power consumption in high-performance products, and enables high speed interfaces when applied to analog and RF applications.

Amkor Technology, Inc. Presents at Credit Suisse 18th Annual Technology Conference, Dec-03-2014 11:30 AM

Amkor Technology, Inc. Presents at Credit Suisse 18th Annual Technology Conference, Dec-03-2014 11:30 AM. Venue: The Phoenician, 6000 East Camelback Road, Scottsdale, AZ 85251, United States. Speakers: Joanne Solomon, Chief Financial Officer and Executive Vice President.

IDEX ASA Enters into Memorandum of Understanding with Amkor Technology to Formalize a Strategic Mass Volume Manufacturing Partnership for Fingerprint Sensors

IDEX ASA has entered into a memorandum of understanding with Amkor Technology. The companies formalize significant development progress over the last six months. Amkor is a first-tier supply chain partner for mass production of IDEX's fingerprint sensors. The agreement enables competitive commercialization of IDEX's fingerprint sensor technology by leveraging Amkor's precision manufacturing capabilities for IDEX advanced off-chip fingerprint sensors. In addition, the parties will leverage Amkor's customer base to increase finger print sensor deployment and market penetration within high-growth market sectors.


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