Last $34.61 USD
Change Today +0.06 / 0.17%
Volume 783.9K
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As of 8:04 PM 12/26/14 All times are local (Market data is delayed by at least 15 minutes).

spansion inc-class a (CODE) Snapshot

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spansion inc-class a (CODE) Details

Spansion, Inc. designs, manufactures, develops, and sells embedded systems semiconductors worldwide. The company offers flash memory, microcontrollers, mixed-signal and analog products, and embedded system-on-chip solutions. It provides a family of parallel and serial NOR flash memory, as well as a range of lower density NAND flash memory products for non-commodity embedded applications. The company also offers a family of 8-, 16-, 32-bit proprietary and 32-bit ARM based microcontrollers that are used in automotive products, such as body electronics, chassis and safety, power train and hybrid, home appliances, digital audio/video equipment, and industrial and office equipment. In addition, it provides power management integrated circuits (IC), including DC/DC converters, voltage regulators and supervisors, and power monitoring and reset ICs; and a family of LED lighting driver ICs and energy harvesting solutions. In addition, it is involved in licensing intellectual property to third parties, as well as assisting customers in developing and prototyping their designs by providing software and hardware development tools, drivers, and simulation models for system-level integration. The company markets and sells its products directly or through third-party distributors to original equipment manufacturers, original design manufacturers, and contract manufacturers. Spansion, Inc. was incorporated in 2005 and is headquartered in Sunnyvale, California.

3,685 Employees
Last Reported Date: 07/8/14
Founded in 2005

spansion inc-class a (CODE) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $830.8K
Chief Financial Officer, Principal Accounting...
Total Annual Compensation: $416.3K
Compensation as of Fiscal Year 2013.

spansion inc-class a (CODE) Key Developments

Spansion Inc. and Sensoplex Announces a Partnership to Jointly Develop and Market an Evaluation and Development Kit Platform

Spansion Inc. and Sensoplex announced a partnership to jointly develop and market an evaluation and development kit platform (EVK and SDK) that will allow customers to quickly develop innovative wearable applications that can combine inertial, bio and environmental sensors, Bluetooth Low Energy (BLE), and ANT+ wireless protocols with ultra low-power processing. The companies will demonstrate the solution at CES, South Hall 2, Spansion booth MP25471. The platform from Spansion and Sensoplex offers outstanding performance for wearable devices and can greatly reduce time to market. The manufacturing-ready platform can be mass-produced as is or rapidly customizable for different form factors and specifications. The platform includes the following: Spansion FM3 microcontrollers with low-power management for battery-powered applications. Spansion FL-S serial Flash memory at 256Mb, which is ideal for small packaging and low power to store raw or processed sensor data. Sensoplex PDI air interface for wireless data communications over BLE or ANT+. Sensoplex APIs for customer firmware development. Sample apps for Android and iOS with source code to aid in quick app development. Additional Sensoplex design and manufacturing services. FCC and CE certification, speeding time to market.

DNP Selects Spansion's Energy Harvesting PMICs for Battery-Free Beacon Modules

Spansion Inc. and Dai Nippon Printing Co. Ltd., or DNP, have announced DNP has selected Spansion's energy harvesting power management integrated circuits, or PMICs, for its battery-free beacon modules to implement field experiments of indoor positioning and online to offline, or O2O, services in airports and shopping malls. Spansion's family of energy harvesting PMICs enable the development of eco-friendly IoT devices, which can be operated without battery or fuel. The PMICs implemented in the beacons can effectively extract energy from both sunlight and vibration. The power source is provided by the solar battery panels, which are embedded within the module and are half the size of a business card.

Cypress Semiconductor Corp. and Spansion, Inc. Announces Board Appointments

Cypress Semiconductor Corp. and Spansion Inc. announced a definitive agreement to merge in an all-stock, tax-free transaction valued at approximately $4 billion. The post-merger company will generate more than $2 billion in revenue annually and create a leading global provider of microcontrollers and specialized memories needed in today's embedded systems. The shareholders of each company will own approximately 50% of the post-merger company. The company will have an eight-person board of directors consisting of four Cypress directors, including T.J. Rodgers and Eric Benhamou, and four Spansion directors, including John Kispert and Ray Bingham, the Spansion chairman, who will serve as the non-executive chairman of the combined company, which will be headquartered in San Jose, California and called Cypress Semiconductor Corporation.


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