Last $22.79 USD
Change Today +0.75 / 3.40%
Volume 733.8K
CODE On Other Exchanges
Symbol
Exchange
New York
As of 8:04 PM 11/26/14 All times are local (Market data is delayed by at least 15 minutes).

spansion inc-class a (CODE) Snapshot

Open
$22.00
Previous Close
$22.04
Day High
$22.97
Day Low
$21.94
52 Week High
09/19/14 - $23.94
52 Week Low
12/5/13 - $12.12
Market Cap
1.4B
Average Volume 10 Days
788.8K
EPS TTM
$-0.55
Shares Outstanding
62.1M
EX-Date
--
P/E TM
--
Dividend
--
Dividend Yield
--
Current Stock Chart for SPANSION INC-CLASS A (CODE)

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spansion inc-class a (CODE) Details

Spansion, Inc. designs, manufactures, develops, and sells embedded systems semiconductors worldwide. The company offers flash memory, microcontrollers, mixed-signal and analog products, and embedded system-on-chip solutions. It provides a family of parallel and serial NOR flash memory, as well as a range of lower density NAND flash memory products for non-commodity embedded applications. The company also offers a family of 8-, 16-, 32-bit proprietary and 32-bit ARM based microcontrollers that are used in automotive products, such as body electronics, chassis and safety, power train and hybrid, home appliances, digital audio/video equipment, and industrial and office equipment. In addition, it provides power management integrated circuits (IC), including DC/DC converters, voltage regulators and supervisors, and power monitoring and reset ICs; and a family of LED lighting driver ICs and energy harvesting solutions. In addition, it is involved in licensing intellectual property to third parties, as well as assisting customers in developing and prototyping their designs by providing software and hardware development tools, drivers, and simulation models for system-level integration. The company markets and sells its products directly or through third-party distributors to original equipment manufacturers, original design manufacturers, and contract manufacturers. Spansion, Inc. was incorporated in 2005 and is headquartered in Sunnyvale, California.

3,685 Employees
Last Reported Date: 07/8/14
Founded in 2005

spansion inc-class a (CODE) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $830.8K
Chief Financial Officer, Principal Accounting...
Total Annual Compensation: $416.3K
Compensation as of Fiscal Year 2013.

spansion inc-class a (CODE) Key Developments

Spansion Inc. Launches Family of e.MMC NAND Memory Products

Spansion Inc. has launched a family of e.MMC NAND memory products for the consumer, communication and industrial equipment markets. Offered in 8GB and 16GB densities and temperature ranges from -40C to +85C, Spansion's e.MMC NAND memory products address a growing demand for reliable, higher density storage in these markets. The new Spansion e.MMC family complements Spansion's portfolio of parallel and serial NOR flash memory, and SLC NAND flash memory for embedded applications. Spansion e.MMC products use high-density MLC NAND that can be configured into modes that allow for higher reliability, better data protection and enhanced data security. The controller, firmware and product assembly is developed for Spansion's quality-sensitive embedded customer base. These products are subjected to stringent qualification and characterization at the NAND, controller and e.MMC module level to meet Spansion's world-class quality requirements. The Spansion e.MMC S4041-1B1 family supports the JEDEC e.MMC 4.51 command set and also includes support for select e.MMC 5.0 features such as the field firmware update, health self-monitoring and automatic background operations. Spansion's rigorous testing for abrupt power failure allows for high levels of data protection in case of power disruption. The firmware is optimized for efficient performance for embedded use cases, giving the product longer useful life for its targeted customer base. The S4041-1B1 products can be used with Spansion's Memory Diagnostics Toolkit. The Memory Diagnostics Toolkit is an engineering diagnostics, analytics, configuration and programmer toolkit intended for engineers validating Spansion's memory solutions products for their embedded applications. The toolkit simplifies the configuration and aids in validation of the e.MMC device which can lead to faster memory qualification cycles for customers. Volume productions of Spansion's S4041-1B1 products are available now in 8GB and 16GB densities. Package options include 153 BGA (0.5mm ball pitch) and 100 BGA (1.0mm ball pitch) packages. Temperature options include -25C to +85C and -40C to +85C. Spansion plans to introduce 4GB, 32GB and 64GB densities in the future.

Spansion Inc. Licenses ARM Cortex-M7 Processor

Spansion Inc. announced it has licensed the ARM Cortex-M7 processor, which will be integrated into the company's next-generation MCUs and system solutions. Spansion, which recently introduced 96 new MCUs as part of its high-performance FM4 family for Industrial IoT, has a comprehensive roadmap with differentiating features and high levels of integration that maintains hardware & software compatibility between the existing FM0+, FM3 and FM4 product families. These product families address customer requirements for high-performance, scalability, low power and reliability for a diverse range of embedded systems with application-specific features and a robust support ecosystem.

Spansion Expands High Density Automotive Serial Flash with 125C Operation

Spansion Inc. expanded its automotive grade Serial NOR flash product line. Spansion's FL-S family in 128Mb and 256Mb densities has been qualified for the extended temperature range of -40C to +125C. The added temperature offerings meet Spansion's high standards for quality and performance, which embedded customers have come to rely on, and complement the existing serial flash memory portfolio, ranging from 4Mb to 1Gb. Key features of the 128Mb (S25FL128S) and 256Mb (S25FL256S) SPI devices are extended operating temperature of -40C to +125C; equivalent performance to Spansion's -40C to +105C range devices; SOIC, WSON, BGA packages; extended addressing for access to higher memory density; configurable read latency for faster access time or higher clock rates; Double Data Rate (DDR) read commands for SIO, DIO and QIO; and advanced sector protection for individually protecting each sector.

 

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