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infineon technologies ag (IFNNF) Snapshot

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infineon technologies ag (IFNNF) Details

Infineon Technologies AG offers semiconductors and system solutions in Europe, the Middle East, Africa, the Asia-Pacific, and the Americas. It operates through four segments: Automotive, Industrial Power Control, Power Management & Multimarket, and Chip Card & Security. The Automotive segment offers microcontrollers automotive and industrial applications; software development platform; discrete power semiconductors; IGBT modules; voltage regulators; power ICs; bus interface devices; magnetic and pressure sensors; and wireless transmit and receive ICs. Its products used in chassis and comfort electronics, electric and hybrid vehicles, and power trains, as well as safety and security applications. The Industrial Power Control segment provides IGBT modules, discrete IGBTs, bare dies, and driver ICs used in charger station for electric vehicles, energy transmission and conversion, home appliances, industrial drives, industrial vehicles, renewable energy generation, tractions, and uninterruptable power supplies. The Power Management & Multimarket segment offers discrete low-voltage and high-voltage power transistors, driver ICs, control ICs, RF power transistors, CMOS RF switches for antenna modules, antenna tuning ICs, MEMS and ASICs for silicon microphones, and customized chips, as well as small-signal components, such as transient voltage suppressor and low noise amplifiers. Its products are used in a range of applications, including cellular network infrastructure, light management and LED lighting systems, micro-inverter for photovoltaic rooftop systems, mobile devices, and power supplies. The Chip Card & Security segment provides contact-based and contactless security controllers, and dual interface security controllers. Its products are authentication, government identification, health care cards, mobile communication, near field communication, payment system, ticketing access control, and computing applications. The company is headquartered in Neubiberg, Germany.

25,762 Employees
Last Reported Date: 11/27/14

infineon technologies ag (IFNNF) Top Compensated Officers

Chairman of the Management Board, Chief Execu...
Total Annual Compensation: €1.4M
Chief Financial Officer, Executive Vice Presi...
Total Annual Compensation: €993.0K
Executive Vice President and Member of the Ma...
Total Annual Compensation: €993.0K
Compensation as of Fiscal Year 2014.

infineon technologies ag (IFNNF) Key Developments

Infineon Technologies and United Microelectronics Corporation Announce Manufacturing Agreement for Automotive Applications

Infineon Technologies AG and United Microelectronics Corporation announced the extension of their manufacturing partnership into power semiconductors for automotive applications. Prior to this expanded partnership, the foundry had been producing Infineon's logic chips for more than 15 years. Based on the recently signed agreement, both companies will jointly transfer Infineon's automotive-qualified Smart Power Technology (SPT9) to UMC and extend its production to 300mm wafers. Production start of SPT9 products at UMC's 300mm Fab in Taiwan is planned for early 2018. SPT9 is a proprietary 130-nanometer (nm) process technology of Infineon that combines microcontroller intelligence and power technology on a single die.

Infineon Technologies AG Launches Bipolar Power Modules in Solder Bond Technology to Address the Specific Requirements of Cost-Effective Applications

Infineon Technologies AG launches bipolar power modules in solder bond technology to address the specific requirements of cost-effective applications. With these new PowerBlock modules the company expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. Infineon offers optimized solutions for different applications like industrial drives, renewable energy, soft starters, UPS systems, welding and static switches driven by cost and/or performance restrictions. With market prices of approximately 25% (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder PowerBlock modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must. Whenever high robustness is a key criterion, like for soft starters or static switches, Infineon offers the pressure contacts as the best solution. For example, in an input rectifier application directly operating under harsh line voltage conditions the requirements for robustness increase with module size, demanding for the highly reliable pressure contact technology. The new PowerBlock modules are available in package types with base plate widths of 20mm, 34mm or 50mm. For each package five module types for easy rectifier designs (2 x Thyristor/Thyristor TT, 2 x Thyristor/Diode TD and 1 x Diode/Diode DD) are offered. Infineon is covering the main current ratings per package size; all types are available with 1600V blocking voltage. The company is the only European vendor, offering 20 mm, 34 mm and 50 mm modules for different application requirements - modules in solder bond technology for cost optimized industrial standard solutions and modules in pressure contact technology for high current applications and higher reliability.

Infineon Technologies AG Proposes Dividend for 2014; Announces Unaudited Group Earnings Results for the Fourth Quarter and Year Ended September 30, 2014; Provides Earnings Guidance for the First Quarter and Full Year of 2015

The Management Board and the Supervisory Board of Infineon Technologies AG have decided to put forward a proposal at the Annual General Meeting (to be held in Munich on February 12, 2015) that the dividend for the 2014 fiscal year be raised by EUR 0.06 to EUR 0.18. This proposed level of dividend is at the upper end of the range of EUR 0.16 to EUR 0.18 per share communicated in May 2014. The company also announced unaudited group earnings results for the fourth quarter and year ended September 30, 2014. For the quarter, the company reported revenue of EUR 1,175 million compared to EUR 1,110 million a year ago. Revenue growth was particularly strong in the Industrial Power Control (IPC), Power Management & Multimarket (PMM) and Chip Card & Security (CCS) segments. Income from continuing operations was EUR 148 million compared to EUR 143 million a year ago. Net income was EUR 181 million compared to EUR 143 million a year ago. Basic and diluted earnings per share from continuing operations was EUR 0.13 compared to EUR 0.13 a year ago. Free cash flow from continuing operations increased significantly quarter-on-quarter from EUR 78 million to EUR 158 million. The considerably higher level of net cash provided by operating activities was only partly reduced by increased investments. For the year 2014, revenue was up by 12% to EUR 4,320 million. For the first quarter of 2015, due to the seasonal decline of demand towards the end of the calendar year, the company expects revenue to decrease by between 5% and 9%. For the 2015 fiscal year, based on an assumed exchange rate of USD 1.30 to the euro, the company forecasts a year-on-year growth in revenue of 8%, plus or minus 2 percentage points. Planned investments for the 2015 fiscal year are around EUR 700 million, containing an amount of about 13% of sales for investments for equipment within operating facilities and for intangibles as one part. In addition between EUR 60 and EUR 70 million will be spent for readying the second shell in Kulim, Malaysia, for volume production and payments of approximately EUR 20 million are required for the purchase of Qimonda patents in conjunction with the settlement recently reached with the insolvency administrator of Qimonda AG. Depreciation and amortization should amount to approximately EUR 600 million.


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