Last $14.62 USD
Change Today +0.11 / 0.76%
Volume 257.9K
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As of 8:10 PM 09/18/14 All times are local (Market data is delayed by at least 15 minutes).

kulicke & soffa industries (KLIC) Snapshot

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09/8/14 - $15.23
52 Week Low
01/27/14 - $10.73
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kulicke & soffa industries (KLIC) Details

Kulicke and Soffa Industries, Inc. designs, manufactures, and sells capital equipment and expendable tools to assemble semiconductor devices, including integrated circuits, discrete devices, light-emitting diodes, and power modules. The company also services, maintains, repairs, and upgrades its equipment. It operates in two segments, Equipment and Expendable Tools. The Equipment segment manufactures and sells a line of ball bonders to connect very fine wires made of gold or copper between the bond pads of the semiconductor devices or dies, and the leads on its package; heavy wire wedge bonders for the power semiconductor and automotive power module markets; wafer level bonders, which mechanically apply bumps to die for some variants of the flip chip assembly process; and manual wire bonders, as well as offers spare parts, equipment repair, and training services. The Expendable Tools segment provides various expendable tools for a range of semiconductor packaging applications. This segment’s products include capillaries, which are used in ball bonders; bonding wedges used in heavy wire wedge bonders; and dicing blades that are used by semiconductor manufacturers to cut silicon wafers into individual semiconductor die, as well as to cut semiconductor devices that have been moulded in a matrix configuration into individual units. The company serves semiconductor device manufacturers, outsourced semiconductor assembly and test providers, other electronics manufacturers, and automotive electronics suppliers primarily in the United States and the Asia/Pacific region. Kulicke and Soffa Industries, Inc. was founded in 1951 and is headquartered in Singapore.

1,914 Employees
Last Reported Date: 11/14/13
Founded in 1951

kulicke & soffa industries (KLIC) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $677.8K
Chief Financial Officer, Chief Information Of...
Total Annual Compensation: $362.6K
Senior Vice President of Legal Affairs and Ge...
Total Annual Compensation: $279.7K
Vice President of Global Engineering
Total Annual Compensation: $236.3K
Compensation as of Fiscal Year 2013.

kulicke & soffa industries (KLIC) Key Developments

Kulicke and Soffa Industries Launches ConnXPS Led Plus

Kulicke and Soffa Industries, Inc. has announced the launch of its ConnXPS LED PLUS Wire Bonder for LED applications. The ConnXPS LED PLUS is a second generation ball bonder for the LED market under the successful Power Series, which further sets new standards and benchmarks in the LED market.

Kulicke and Soffa Industries, Inc. Introduces New Chip-To-Substrate Bonder

Kulicke and Soffa Industries, Inc. has introduced APAMA, or Advanced Packaging with Adaptive Machine Analytics, a new chip-to-substrate, or C2S, bonder. The APAMA was designed with performance and accuracy in mind, delivering the best-in-class die-stacking solution for 2.5D /3D or TSV integrated chips. The key highlights of APAMA include: Placement Accuracy; Yield Enhancement; and Cost-of-Ownership Advantage. The APAMA's direct-drive Z-axis bond head enables precise motion control for accurate placement with both low and high bond force. APAMA's extensive integrated inspection and metrology suite will accelerate the ramp to production. Inspection stations are strategically placed to detect and prevent defects from propagating. On tool overlay metrology, coupled with advanced analytics, will detect any potential process drift. The APAMA has excellent temperature control at the work and tool surfaces. It also offers industry-leading, fully programmable, fast, heating and cooling ramp rates for maximum throughput.

Kulicke and Soffa Industries, Inc. Expands PowerFusion Wedge Bonders with the HLx for Wide Leadframe Applications

Kulicke and Soffa Industries, Inc. announced its expanding the PowerFusion(PS) Wedge Bonders with the HLx model for extra-wide matrix and IPM leadframe applications up to 105mm wide. The PowerFusion(PS) Wedge Bonders now come in three different models, with single or multiple head configurations, for a wider variety of choices for customer applications. The PowerFusion(PS) Bonders are designed for productivity, performance, advanced power semiconductor package capability, ease of use, configuration flexibility and reliability. PowerFusion's productivity reduces manufacturing costs by improving uptimes and higher bond yields, largely contributed by its robust design and innovative features which are optimized for the prevailing and upcoming power semiconductor packaging trends. The TL model is the perfect choice for bonding single-row to four-row matrix TO power devices. It is upgradeable to the HL Model in case advanced interconnect requirements are needed in the future. The HL Model is specially designed to enable large wire, small wire and PowerRibbon bonding in advanced interconnect designs. Whether bonding high density power devices like SO-8 & PDFN or stretching the wire limit on a matrix D-Pak, the superior indexing accuracy and clamping capabilities of the HL model deliver consistent quality. The NEW HLx Model has all the high performance capabilities of the HL Model with the added benefit of handling leadframes up to 105mm wide.


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