Last $0.49 USD
Change Today -0.0098 / -1.96%
Volume 114.5K
LEDS On Other Exchanges
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As of 8:10 PM 09/19/14 All times are local (Market data is delayed by at least 15 minutes).

semileds corp/tw (LEDS) Snapshot

Open
$0.49
Previous Close
$0.50
Day High
$0.51
Day Low
$0.47
52 Week High
03/11/14 - $1.66
52 Week Low
09/17/14 - $0.46
Market Cap
13.9M
Average Volume 10 Days
213.7K
EPS TTM
$-0.97
Shares Outstanding
28.4M
EX-Date
--
P/E TM
--
Dividend
--
Dividend Yield
--
Current Stock Chart for SEMILEDS CORP/TW (LEDS)

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semileds corp/tw (LEDS) Details

SemiLEDs Corporation develops, manufactures, and sells light emitting diode (LED) chips and LED components. Its products are used primarily for general lighting applications, including street lights and commercial, industrial, and residential lighting, as well as specialty industrial applications, such as ultraviolet (UV) applications, curing of polymers, LED light therapy in medical/cosmetic applications, counterfeit detection, LED lighting for horticulture applications, and architectural lighting applications. The company markets and sells blue, green, and UV LED and enhanced vertical LED chips under the MvpLED brand name to packagers, or distributors that sell to packaging customers in China, Taiwan, Russia, and the United States. It also packages its LED chips into LED components and sells to distributors and end-customers. SemiLEDs Corporation was incorporated in 2005 and is based in Chunan, Taiwan.

519 Employees
Last Reported Date: 11/26/13
Founded in 2005

semileds corp/tw (LEDS) Top Compensated Officers

Founder, Chairman, Chief Executive Officer an...
Total Annual Compensation: $405.0K
General Manager for Energy Solutions
Total Annual Compensation: $220.0K
General Manager of SemiLEDs Optoelectronics C...
Total Annual Compensation: $196.2K
Compensation as of Fiscal Year 2013.

semileds corp/tw (LEDS) Key Developments

SemiLEDs Corporation Receives Non-Compliance Notice From NASDAQ Stock Market

On August 26, 2014, SemiLEDs Corporation (Company) received a letter from The NASDAQ Stock Market notifying the Company that it is not in compliance with the minimum bid price requirement set forth in Nasdaq Listing Rule 5450(a)(1) for continued listing on the Nasdaq Global Select Market. The Nasdaq Listing Rules require listed securities to maintain a minimum bid price of $1.00 per share and, based on the closing bid price for the last 30 consecutive business days, the Company no longer meets that requirement. The notification letter does not impact the Company’s listing on the Nasdaq Global Select Market at this time. In accordance with Nasdaq Listing Rule 5810(c)(3)(A), the Company has been provided 180 calendar days, or until February 23, 2015, to regain compliance with Nasdaq Listing Rule 5450(a)(1). To regain compliance, the Company’s common stock must have a closing bid price of at least $1.00 for a minimum of 10 consecutive business days. In the event the Company does not regain compliance by February 23, 2015, the Company may be eligible for additional time.

SemiLEDs Corporation Launches EF FlipChip LED Series

SemiLEDs Corporation announced sampling and volume availability of the first in its new Enhanced FlipChip, or EF, LED series. The series launches with the EF-B40, a blue 40-mil flip chip that simplifies the packaging and integration process by eliminating wire-bonding while increasing both lumen-density and decreasing the lumen-per-dollar value proposition while enabling packagers to use standard surface mount assembly techniques. Flip chip construction presents what was originally the bottom sapphire layer in a horizontal LED structure as the top surface of the chip. By 'flipping' the chip in this manner, the electrical pads become part of the bottom of the device rather than running bonding wires from the top surface of the chip down to the package or board. Not only are delicate areas of the chip protected by the clear sapphire layer, but by eliminating wire bonds, arguably the most failure-prone part of any LED assembly, both reliability and overall design flexibility of the packaged device are increased. In addition, individual chips may be more closely mounted, opening the door to more densely packed arrays of LED chips. The nearly continuous light emitting surface, unbroken by gaps, bonding wires, or top electrodes, can greatly simplify the mounting and mixing requirements of the optics, producing smooth lighting effects. In addition, in a flip chip structure, the heat-generating junction is positioned adjacent to the substrate, increasing thermal conductivity and allowing improved device performance at high currents. The EF-B40 is available in wavelengths from 445 to 460nm, with outputs of up to 300 lumens at 1A as a packaged emitter. The SAC compatible chips are offered with standard Au bonding pads, or are available with an AuSn option to further reduce thermal resistance and add to system reliability. A 140-degree viewing angle makes the EF ideal for general and commercial lighting, while the lowered profile addresses the application needs of LED backlight, smartphone flash or LED projector.

SemiLEDs Corporation Releases Complete 80x80mil Rugged Metal LED Chips

SemiLEDs Corporation announced sampling and volume availability of a complete line of 80x80mil rugged metal LED chips, including white, blue, and UV variations. The EV-80mil family allows packagers and integrators a wider variety of high-efficiency/high-output choices to address the growing number of applications in both the commercial lighting and industrial spaces. With the new family, a single 80x80mil device will typically replace four 40x40mil LED chips, which simplifies packaging and optical designs, while minimizing color fringing and shadow effects common to multi-chip implementations. SemiLEDs EV family, which combines vertical LED architectures with rugged copper-alloy substrates, has proven to be especially well-suited for handling the increased thermal and electrical demands of large-chip implementations. The new EV-80mil ReadyWhite(TM) chips incorporate SemiLEDs' proprietary phosphor technology, and when packaged in a typical 5x5mm ceramic package, can be expected to deliver up to 1200 lumens at 3A. They are available in correlated color temperatures (CCTs) ranging from 2600 to 10,000K with color rendering indices from a minimum 65 to a minimum of 90, after packaging. Combined with their vertical LED chip architecture, SemiLEDs' ReadyWhite(TM) solutions deliver a package-ready white chip to COB, single-die or multi-die packaging applications, eliminating requirements for sophisticated and costly phosphor manufacturing technology. When driven with currents below 1.0A, with the 80mil ReadyWhite chips deliver up to 145 cool white lumens per watt in typical package configurations, and are suited for such applications as outdoor street or area lighting, or heavy duty flashlights/torches. The 80mil blue chips are available in standard wavelengths from 445 to 460nm, with options up to 470nm additionally available upon request, and deliver up to 4000mW of optical power at 450nm in typical ceramic packaging. As single-chip implementations, the ReadyWhite and blue chips are ideally suited to narrow beam pattern kilolumen applications that benefit from simplified optics and compact emitter sizes, including projectors, MR/GU/PAR spotlights, and automotive front lighting. The reduced chip count from the larger devices also simplifies system architectures for high-bay and other multi-die kilolumen applications.

 

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