Last $69.90 USD
Change Today -0.77 / -1.09%
Volume 1.9M
LRCX On Other Exchanges
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As of 8:10 PM 07/24/14 All times are local (Market data is delayed by at least 15 minutes).

lam research corp (LRCX) Snapshot

Open
$70.93
Previous Close
$70.67
Day High
$70.99
Day Low
$69.74
52 Week High
07/21/14 - $72.41
52 Week Low
08/29/13 - $46.20
Market Cap
11.3B
Average Volume 10 Days
1.7M
EPS TTM
$3.01
Shares Outstanding
162.1M
EX-Date
06/9/14
P/E TM
23.3x
Dividend
$0.72
Dividend Yield
0.26%
Current Stock Chart for LAM RESEARCH CORP (LRCX)

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lam research corp (LRCX) Details

Lam Research Corporation designs, manufactures, markets, refurbishes, and services semiconductor processing equipment used in the fabrication of integrated circuits. The company offers plasma etch products that remove materials from the wafer to create the features and patterns of a device. Its plasma etch products include 2300 Kiyo Product Family that provides solutions for conductor etch applications; 2300 Flex Product Family, which offers technologies and application-focused capabilities for dielectric etch applications; and 2300 Syndion Product Family that provides solutions to address multiple silicon via etch applications. The company also provides thin film deposition products, including SABRE Product Family for copper damascene manufacturing; ALTUS systems deposit conformal atomic layer films for tungsten metallization applications; VECTOR family of plasma-enhanced chemical vapor deposition systems for the deposition of ashable hardmasks, oxides, nitrides, carbides, and anti-reflective layers; SPEED high-density plasma-chemical vapor deposition products for applications in STI, pre-metal dielectrics, inter-layer dielectrics, inter-metal dielectrics, and passivation layers; and SOLA ultraviolet thermal processing product family for the treatment of back-end-of-line low-k dielectric films and front-end-of-line silicon nitride strained films. In addition, the company offers photoresist strip systems, which remove the photoresist mask before a wafer proceeds to the next processing step; single-wafer wet and plasma-based wafer cleaning products that remove particles and residues from the wafer surface before or after adjacent processes; and refurbished and newly built legacy products. The company offers its products in the North America, Korea, Taiwan, Japan, the Asia Pacific, and Europe. Lam Research Corporation was founded in 1980 and is headquartered in Fremont, California.

6,600 Employees
Last Reported Date: 05/8/14
Founded in 1980

lam research corp (LRCX) Top Compensated Officers

Chief Executive Officer, President and Direct...
Total Annual Compensation: $776.9K
Chief Financial Officer, Chief Accounting Off...
Total Annual Compensation: $149.2K
Chief Operating Officer and Executive Vice Pr...
Total Annual Compensation: $574.3K
Executive Vice President of Global Products G...
Total Annual Compensation: $488.2K
Chief Legal Officer, Senior Vice President, G...
Total Annual Compensation: $432.8K
Compensation as of Fiscal Year 2013.

lam research corp (LRCX) Key Developments

Lam Research Corp. Unveils Latest Thin Film Deposition and Plasma Etch Products for 3D NAND Fabrication

Lam Research Corp. unveiled its latest thin film deposition and plasma etch products for 3D NAND fabrication. As memory customers begin ramping production of these new devices, greater process control is needed for cost-effective manufacturing. Lam's new systems address this need for three of the most critical steps in forming 3D NAND memory cells: stack deposition (VECTOR(R) Q Strata(TM)), vertical channel etching (2300(R) Flex(TM) F Series), and tungsten wordline deposition (ALTUS(R) Max ICEFill(TM)). The 3D NAND memory structures now moving to production involve numerous pairs of stacked films. Process variability on both the horizontal and vertical planes must be minimized for critical steps so that each memory cell in the final device delivers similar performance. Otherwise, variation in one step can be transferred and multiplied in subsequent steps, compounding errors and leading to poor device performance and low product yield. With 40 or more pairs of films in the stack, carefully managing even slight process fluctuations is essential. Lam's new products address these stringent control requirements. The new VECTOR Q Strata PECVD (plasma enhanced chemical vapor deposition) system is used for depositing multilayer film stacks. For this critical 3D NAND process step, the system can perform both oxide/nitride (ONON) and oxide/polysilicon (OPOP) film stack deposition. To deposit the ultra-smooth, uniform films required to avoid compounding errors, the system's matched chambers deliver superior defectivity, film stress, and wafer bow performance. In addition, the VECTOR Q Strata also provides productivity with the high throughput per square meter of fab area available. As the number of layers in these stacks continues to grow, high productivity is increasingly important for cost-effective production.

Lam Research Expands its Portfolio for Atomic-Scale Processing

Lam Research Corp. announced the addition of atomic layer etch (ALE) to its portfolio of atomic layer deposition (ALD) products. The new production-worthy ALE capability on the 2300(R) Kiyo(R) F Series conductor etch system delivers atomic-scale variability control to enable next-generation wafer processing. Together with Lam's VECTOR(R) ALD Oxide product for dielectric film ALD and ALTUS(R) systems for tungsten metal film ALD, these products support the industry's shift toward manufacturing chips at the atomic scale, where every atom matters. Lam's new ALE capability on the 2300 Kiyo F Series conductor etch system provides both the productivity and technology needed. The product leverages fast gas switching and advanced plasma techniques in the reactor to boost throughput, while dynamic RF bias enables the directional etching required to remove material in high aspect ratio (deep and narrow) features. As the latest offering in Lam's market-leading Kiyo family, the 2300 Kiyo F Series system continues to provide superior uniformity and repeatability enabled by a symmetrical chamber design, advanced electrostatic chuck technology, and independent process tuning features. Lam's ALTUS product family is the benchmark for tungsten film production and has been in use for a number of years for the atomic-layer deposition of tungsten and tungsten-nitride metals. Proprietary deposition technology and system architecture enable the formation of highly conformal barrier and metal films that offer low resistivity. In addition, the ALTUS ALD process is able to completely fill the re-entrant structures that are commonly found in advanced memory and logic applications.

Lam's New Etch and Deposition Products Control Process Variability to Enable Advanced Multiple Patterning

Lam Research Corp. released two new products that deliver the stringent process control and productivity needed for advanced patterning. Multiple patterning strategies rely on etch and deposition to extend the use of optical lithography and involve an increasing number of these enabling process steps. Lam's 2300(R) Kiyo(R) F Series conductor etch system uses a breakthrough technology -- the Hydra(TM) Uniformity System -- to enable cross-wafer process control that corrects for incoming pattern non-uniformities. The VECTOR(R) ALD Oxide system uses atomic layer deposition (ALD) to create the highly conformal dielectric films that are used to define critical pattern dimensions in a multiple patterning sequence. Double and quadruple patterning schemes are being used by chipmakers to compensate for limitations in optical lithography. These techniques create smaller features than would be possible from single patterning by printing larger, less dense patterns and then shrinking both the size and the spacing by repeating some combination of lithography/etch/deposition steps to achieve the desired dimensions. With the increased number of process steps, variability challenges are exacerbated since each individual step contributes to overall non-uniformity. Because of this compounding effect, variability tolerances for etch and deposition need to be far more stringent in order for devices to function as intended. Process control is essential since variability can impact device performance, power consumption, and yield, which may lead to costly and time-consuming rework. In addition to variability control, high productivity is required to mitigate the increased manufacturing costs from additional process steps.

 

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LRCX

Industry Average

Valuation LRCX Industry Range
Price/Earnings 24.9x
Price/Sales 2.6x
Price/Book 2.4x
Price/Cash Flow 23.6x
TEV/Sales 1.7x
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