Microsemi Corporation announced a next-generation family of self-encrypting solid state drives (SSDs) for applications requiring superior data security, outstanding reliability, ruggedization, large storage capacity and high sustained data throughput rates. The first new product in the TRRUST-Stor(TM) Series 200 family is a 256 gigabyte (GB) 2.5" SATA SSD that operates at sustained rates of 200 megabytes per second (MB/s). The company has secured multiple design-wins for its new Series 200 SSD and initial shipments to customers are underway. TRRUST-Stor Series 200 SSDs are ideal for high bandwidth land-, air-, and ship-based video streaming and surveillance applications where recording every second of data is important. The high capacity Series 200 also provides ample storage for imaging applications such as those used in UAVs and vetronics. The TRRUST-Stor Series 200 is powered by Microsemi's second generation Armor(TM) processor. A full hardware-based erase takes less than eight seconds, the fastest erase time on the market. The Series 200 SSDs also offer the ability to load encryption keys. Customers can input their own AES-256 keys, purge them and re-load as needed. Microsemi's TRRUST-Purge(TM) technology destroys keys in less than 30 milliseconds when activated.

Microsemi Corporation announced shipment of production-qualified SmartFusion(R) 2 system-on-chip (SoC) field programmable gate arrays (FPGAs). The company also announced the availability of its full-featured SmartFusion2 development kit with support for mainstream industry interfaces. Since the SmartFusion2 introduction in October 2012, Microsemi has engaged with over 400 customers worldwide, and the device family has been adopted into numerous customer systems in the communications, industrial and defense markets. Microsemi's lead customer program, coupled with the early availability of SoC development tools and now production-qualified devices and a development kit, enables customers to ramp to manufacturing volumes in a timely manner. SmartFusion2 Development Kit Features: SmartFusion2 M2S050T-FGG896 SoC FPGA; 56K logic element, 256Kbit eNVM, 1.5Mbit SRAM and additional distributed SRAM in the FPGA fabric; External SDRAM memory controller; Peripherals include triple-speed Ethernet, USB 2.0, SPI, CAN, DMAs I2Cs, UARTs and timers; 16 x 5Gbps SERDES (can be evaluated through SMP connectors,) PCIe Gen2 x4 and XAUI/XGXS+ native SERDES; Provides the most general purpose and 3.3V I/Os in the industry; ability to evaluate DDR and GPIO performance; Build PCI Express(R) endpoint applications through the X4 PCIe Gen1/Gen2 edge fingers provided on the board; PD70201 PoE; DDR/SDRAM; eMMC and 4GB NAND flash memory and SPI flash and 8MB modules.

Microsemi Corporation Presents at Barclays Global Technology, Media and Telecommunications Conference, May-22-2013 04:25 PM. Venue: Crowne Plaza Times Square, 1605 Broadway (at 49th Street), New York, New York, United States. Speakers: Paul Pickle, EVP, Robert C. Adams, Vice President of Corporate Development.