Last $9.59 USD
Change Today -0.04 / -0.42%
Volume 21.5K
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As of 12:06 PM 08/22/14 All times are local (Market data is delayed by at least 15 minutes).

rudolph technologies inc (RTEC) Snapshot

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01/8/14 - $12.32
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rudolph technologies inc (RTEC) Details

Rudolph Technologies, Inc. designs, develops, manufactures, and supports process control defect inspection, advanced packaging lithography, metrology, and process control software systems used in semiconductor device manufacturing. It offers process and yield management solutions used in wafer processing and final manufacturing through standalone systems for macro-defect inspection, lithography, probe card test and analysis, and transparent and opaque thin film measurements. The company’s process control software solutions are used in semiconductor, solar, and LED manufacturing. It markets and sells its products to logic, memory, data storage, flat panel, and application-specific integrated circuit device manufacturers. The company offers its products in the United States, China, Germany, Japan, South Korea, Singapore, Taiwan, and Scotland. Rudolph Technologies, Inc. was founded in 1940 and is headquartered in Flanders, New Jersey.

rudolph technologies inc (RTEC) Top Compensated Officers

Chairman and Chief Executive Officer
Total Annual Compensation: $661.2K
Chief Financial Officer, Principal Accounting...
Total Annual Compensation: $303.2K
Senior Vice President and General Manager of ...
Total Annual Compensation: $296.7K
Vice President of Data Analysis & Review Busi...
Total Annual Compensation: $279.6K
Compensation as of Fiscal Year 2013.

rudolph technologies inc (RTEC) Key Developments

Rudolph Receives Volume Purchase Order from Major Taiwan OSAT for 2D/3D Inspection Systems

Rudolph Technologies Inc. announced that it has received a large order from one of Taiwan's providers of independent semiconductor manufacturing services in assembly and test (OSAT). The order includes: multiple NSX(R) systems for two-dimensional (2D) macro defect inspection, the Wafer Scanner(TM) Inspection Series for three-dimensional (3D) inspection and bump height metrology, and Discover(R) software for yield optimization. The sale demonstrates Rudolph's continuing leadership in providing comprehensive inspection and metrology solutions for today's most advanced wafer-level chip-scale packaging (WLCSP) and bumping processes. The NSX family is the market leader for automated macro defect inspection for advanced packaging processes. NSX systems include specific solutions for processes using through silicon vias (TSVs) to connect multiple die in a single package, as well as edge trimming, wafer alignment during bonding processes and sawn wafers on film frames. Rudolph's Wafer Scanner System provides the inspection and metrology for 3D/2D bumps and RDL required throughout post-fab processes for both standard and flip chip wafers.

Rudolph Technologies Inc. Reports Consolidated Unaudited Earnings Results for the Second Quarter and Six Months Ended June 30, 2014; Provides Earnings Guidance for the Third Quarter and Full Year of 2014

Rudolph Technologies Inc. reported consolidated unaudited earnings results for the second quarter and six months ended June 30, 2014. Second quarter revenue totaled $43.0 million, a 3% increase compared with $41.6 million for the 2014 first quarter. GAAP net loss for the second quarter of 2014 was $4.4 million, or $0.13 per diluted share, compared with a net loss of $724 thousand, or $0.02 per diluted share, for the first quarter of 2014. Operating loss was $9.492 million against income of $2.134 million a year ago. Loss before income taxes was $10.995 million against income of $1.332 million a year ago. Non-GAAP operating income was $3.646 million against $4.044 million a year ago. Non-GAAP net income was $1.422 million or $0.04 diluted per share against $2.002 million or $0.06 diluted per share a year ago. Capital expenditures for the second quarter were approximately $600,000. For the six-month period, the company reported revenues were $84.667 million against $87.709 million a year ago. Operating loss was $9.379 million against income of $3.437 million a year ago. Loss before income taxes was $12.036 million against income of $1.077 million a year ago. Net loss was $5.136 million or $0.15 diluted per share against income of $1.152 million or $0.03 diluted per share a year ago. Non-GAAP operating income was $6.544 million against $7.174 million a year ago. Non-GAAP net income was $2.421 million or $0.07 diluted per share against $3.581 million or $0.11 diluted per share a year ago. For the third quarter, the company anticipates operating expenses will be in the range of $22 million to $23 million, which reflect continued cost containment initiatives, offset by investments in lithography operations. Gross margins will be in the range of 53% to 54%. For the full year, assuming no reinstatement of the R&D credit, the company anticipates effective tax rate to be around 35%. Non-GAAP earnings are forecast to range from $0.04 to $0.05. For the calendar year, the company previously guided $200 million, plus or minus 5%, or $190 million at the low end of guidance, which, at that level, may forecast of up 7.8% for the year.

Rudolph Technologies, Inc. Announces Availability of its New SONUS(TM) Technology

Rudolph Technologies Inc. announced the availability of its new SONUS(TM) Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs). SONUS Technology is a non-contact, non-destructive acoustic metrology and defect detection technique that is designed to be of higher resolution, faster, and less costly than alternative techniques. Copper pillar bumps and TSVs are key enabling technologies in the rapidly growing field of advanced packaging where 2.5D and 3D assembly schemes are driving the More than Moore roadmap. Rudolph has collaborated with TEL NEXX specifically to develop pillar bump and TSV plating process control based on SONUS Technology.


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