Last $9.63 USD
Change Today -0.22 / -2.23%
Volume 207.0K
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rudolph technologies inc (RTEC) Snapshot

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07/25/13 - $12.90
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05/7/14 - $8.91
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rudolph technologies inc (RTEC) Details

Rudolph Technologies, Inc. designs, develops, manufactures, and supports process control defect inspection, advanced packaging lithography, metrology, and process control software systems used in semiconductor device manufacturing. It offers process and yield management solutions used in wafer processing and final manufacturing through standalone systems for macro-defect inspection, lithography, probe card test and analysis, and transparent and opaque thin film measurements. The company’s process control software solutions are used in semiconductor, solar, and LED manufacturing. It markets and sells its products to logic, memory, data storage, flat panel, and application-specific integrated circuit device manufacturers. The company offers its products in the United States, China, Germany, Japan, South Korea, Singapore, Taiwan, and Scotland. Rudolph Technologies, Inc. was founded in 1940 and is headquartered in Flanders, New Jersey.

615 Employees
Last Reported Date: 02/27/14
Founded in 1940

rudolph technologies inc (RTEC) Top Compensated Officers

Chairman and Chief Executive Officer
Total Annual Compensation: $661.2K
Chief Financial Officer, Principal Accounting...
Total Annual Compensation: $303.2K
Senior Vice President and General Manager of ...
Total Annual Compensation: $296.7K
Vice President of Data Analysis & Review Busi...
Total Annual Compensation: $279.6K
Compensation as of Fiscal Year 2013.

rudolph technologies inc (RTEC) Key Developments

Rudolph Technologies, Inc. Announces Availability of its New SONUS(TM) Technology

Rudolph Technologies Inc. announced the availability of its new SONUS(TM) Technology, designed for measuring thick films and film stacks used in copper pillar bumps and for detecting defects, such as voids, in through silicon vias (TSVs). SONUS Technology is a non-contact, non-destructive acoustic metrology and defect detection technique that is designed to be of higher resolution, faster, and less costly than alternative techniques. Copper pillar bumps and TSVs are key enabling technologies in the rapidly growing field of advanced packaging where 2.5D and 3D assembly schemes are driving the "More than Moore" roadmap. Rudolph has collaborated with TEL NEXX specifically to develop pillar bump and TSV plating process control based on SONUS Technology.

Veeco Instruments Inc. Forms Strategic Partnership with Rudolph Technologies Inc

Veeco Instruments Inc. has formed a strategic partnership with Rudolph Technologies Inc. to improve customer productivity and equipment cost of ownership. This collaboration allows users of Veeco's etch and deposition equipment access to Rudolph's fault detection and predictive maintenance software to increase system productivity and improve manufacturing efficiency. As part of the partnership, Rudolph Technologies and Veeco will also develop technology-specific software solutions that work in unison with Veeco's existing software to enhance tool performance for Veeco's new etch and deposition equipment, as well as upgrades for Veeco's large global installed base. Rudolph's software framework applies to many tool types and processes. When combined with Veeco's advanced tools and system knowledge, the software optimizes real-time and historical data freeing Veeco system users from manual monitoring of equipment and processes.

Rudolph Technologies Inc. Announces Ruling in Litigation with Integrated Technology Corporation

Rudolph Technologies Inc. announced a ruling by the U.S. Supreme Court in the patent infringement lawsuit brought by Integrated Technology Corporation (ITC). The Supreme Court denied Rudolph's petition for writ of certiorari in Integrated Technology Corporation et al. v. Rudolph Technologies Inc., in which Rudolph appealed the ruling by the U.S. Court of Appeals for the Federal Circuit affirming a jury's award of $7.68 million for the infringement of ITC's patent by probe card test and analysis products sold prior to Rudolph's acquisition of the relevant product lines. In addition to the $4.3 million accrued by the company for this litigation, Rudolph will pay ITC an additional $6.3 million to satisfy the judgment and related interest charges. While attorney fees in the amount of an additional $3.25 million continue to be contested, Rudolph has reserved for the full amount.


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