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As of 7:03 AM 10/23/14 All times are local (Market data is delayed by at least 15 minutes).

suess microtec ag (SMHN) Snapshot

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07/2/14 - €9.26
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suess microtec ag (SMHN) Details

Suss MicroTec AG, together with its subsidiaries, develops, manufactures, and markets equipment for the production of microelectronics and micro-electromechanical systems (MEMS) in Europe, North America, Japan, and rest of Asia. It operates through Lithography, Substrate Bonder, Photomask Equipment, and Others divisions. The Lithography division develops, produces, and sells Mask Aligner, developer, spin and spray coater, UV projection lithography systems, and laser processing tools product lines. The components that are processed with these tools are sent to the end markets for advanced packaging, MEMS, compound semiconductors, and 3D integration. The Substrate Bonder division develops, produces, and sells substrate (wafer) bonder product line. The Photomask Equipment division is involved in the development, manufacture, and sale of specialized tools for the cleaning and processing of photomasks for the semiconductor industry. The Others division is involved in the micro-optics and lenses activities; and the controlled collapse chip connection new process business. The company distributes its products through production facilities, as well as through distribution companies. SUSS MicroTec AG was founded in 1949 and is headquartered in Garching, Germany.

649 Employees
Last Reported Date: 08/7/14
Founded in 1949

suess microtec ag (SMHN) Top Compensated Officers

Chief Financial Officer and Member of Executi...
Total Annual Compensation: €348.4K
Compensation as of Fiscal Year 2013.

suess microtec ag (SMHN) Key Developments

Suss MicroTec Reports Sales Results for the Third Quarter and Nine Months of 2014; Reiterates Earnings Guidance for the Full Year of 2014

Suss MicroTec reported sales results for the third quarter and nine months of 2014. The company saw its sales plummet 53% to EUR 25.5 million (USD 32.3 million) in the third quarter of the year. In the first nine months of the year sales inched up by 0.4% to EUR 94.4 million, while new orders slipped almost 15% to EUR 90.3 million. Despite its third-quarter performance, the company reiterated its full-year target for sales in the range of EUR 135 million to EUR 145 million and a slightly positive earnings before interest and tax (EBIT).

Suss MicroTec AG Launches SB6/8 Gen2 Wafer Bonder

Suss MicroTec AG launched the SB6/8 Gen2 Wafer Bonder. The semi-automated SB6/8 Gen2 is SUSS MicroTec's universal permanent wafer bonding system that handles wafers up to 200 mm and supports various substrate types and sizes. The tool allows for fully manual processing in research and development applications while at the same time providing the opportunity of an easy switch to volume production. It supports low force for adhesive bonding as well as high force for thermo compression or eutectic bonding and offers various chamber pressure conditions from vacuum to over pressure. Flexible tooling allows for adapting to different requirements in the semiconductor industry. Major applications are in MEMS and LED packaging and production as well as 3D stacking. The second tool generation provides an advanced heater and force control system as well as improved cooling rates. These new features lead to a more precise control of the bonding processes.

Suss MicroTec AG Presents at Baader Investment Conference, Sep-24-2014

Suss MicroTec AG Presents at Baader Investment Conference, Sep-24-2014 . Venue: Sofitel Munich Bayerpost, Bayerstr. 12, 80335 Munich, Germany.


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