Last $0.58 SGD
Change Today -0.015 / -2.52%
Volume 9.2M
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As of 5:04 AM 07/30/14 All times are local (Market data is delayed by at least 15 minutes).

stats chippac ltd (STAT) Snapshot

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52 Week High
06/11/14 - $0.67
52 Week Low
09/2/13 - $0.30
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stats chippac ltd (STAT) Details

STATS ChipPAC Ltd., together with its subsidiaries, provides semiconductor packaging design, bump, probe, assembly, test, and distribution services for communications, digital consumer, and computing market applications. Its services include post wafer fab process, and back-end assembly and test. The company offers wafer bumping for both 200mm and 300mm wafer sizes in a range of options, including printed bump, ball drop, and plated technology with eutectic, high lead, lead free, and copper column alloys. The company’s wafer bumping offering includes wafer bump and redistribution, turnkey services for advanced flip chip applications, and turnkey services for wafer level chip scale packages. The company’s packaging services support various package technologies, including wafer level products; flip chip packages; copper wirebond packages; ball grid array and fine pitch ball grid array packages; quad flat no-lead and bump chip carrier packages; quad flat pack and thin small outline packages; system-in-package; 3D packages; and memory cards. It also provides a suite of solutions and test platforms comprising test facilities, test platforms, wafer sort, test development services, RF test, mixed signal test, memory test, high-end digital test, strip test, final test, and post test solutions, as well as integrated test management system. In addition, it provides warehousing, drop shipment, administration, and research services. The company markets its services through direct sales force in the United States, South Korea, Japan, China, Singapore, Malaysia, Taiwan, and Switzerland. STATS ChipPAC Ltd. was founded in 1994 and is headquartered in Singapore. STATS ChipPAC Ltd. operates as a subsidiary of Singapore Technologies Semiconductors Pte Ltd.

Founded in 1994

stats chippac ltd (STAT) Top Compensated Officers

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stats chippac ltd (STAT) Key Developments

Several Companies Reportedly Eyes To Acquire STATS ChipPAC

Advanced Semiconductor Engineering Inc. (TSEC:2311), Jiangsu Changjiang Electronics Technology Co., Ltd. (SHSE:600584), Samsung Electronics Co. Ltd. (KOSE:A005930), Tianshui Huatian Technology Co., Ltd. (SZSE:002185) and others vying to buy STATS ChipPAC Ltd. (SGX:S24), a report from technology news provider Digitimes, citing unnamed industry source.

STATS ChipPAC May Be Taken Over

STATS ChipPAC Ltd. (SGX:S24) shares surged as much as 17.8% on speculation that STATS may be taken Over.

STATS ChipPAC Ltd. Introduces eWLCSP Packaging Technology

STATS ChipPAC Ltd. has introduced encapsulated Wafer Level Chip Scale Package, or eWLCSP, a packaging technology. WLCSP is a bare die package that is constantly exposed to potential cracking, chipping and handling damages before or during the SMT process. This is particularly true for advanced node products where the die is very thin and dielectric layers are extremely fragile. eWLCSP is a robust packaging solution that cost effectively addresses the increased durability requirements for customers in advanced silicon nodes down to 28nm. eWLCSP features a thin protective coating on the four sidewalls of the die, achieving increased durability and reliability within the standard Wafer Level Chip Scale Packaging, or WLCSP, size specification. The significant benefit of encapsulation is the light and mechanical protection for the bare die. The protective layer also safeguards the silicon during socket insertion for test. eWLCSP delivers electrical performance that is equivalent to standard WLCSP with proven results in component level reliability (CLR), temperature cycle on board (TCoB) and drop test. The encapsulation advantages in eWLCSP are the result of STATS ChipPAC's new FlexLine manufacturing method. FlexLine is an innovative approach to wafer level manufacturing that seamlessly processes multiple silicon wafer diameters in the same manufacturing line, delivering unprecedented flexibility in producing both fan-out and fan-in packages. Flexline is based on STATS ChipPAC's well established, high volume manufacturing process for fan-out wafer level packaging that provides the ability to scale a device to larger panel sizes for a compelling cost reduction compared to conventional wafer level packaging methods. The FlexLine process has been qualified at advanced silicon nodes down to 28nm, ball pitches down to 0.40mm and body sizes as small as 2.5x2.5mm.


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