Last $20.18 USD
Change Today +0.23 / 1.15%
Volume 15.4M
TSM On Other Exchanges
Symbol
Exchange
Taiwan
New York
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As of 8:04 PM 09/30/14 All times are local (Market data is delayed by at least 15 minutes).

taiwan semiconductor-sp adr (TSM) Snapshot

Open
$19.90
Previous Close
$19.95
Day High
$20.19
Day Low
$19.81
52 Week High
07/11/14 - $23.07
52 Week Low
02/5/14 - $16.44
Market Cap
104.7B
Average Volume 10 Days
10.7M
EPS TTM
--
Shares Outstanding
5.2B
EX-Date
07/14/14
P/E TM
--
Dividend
$0.50
Dividend Yield
2.48%
Current Stock Chart for TAIWAN SEMICONDUCTOR-SP ADR (TSM)

taiwan semiconductor-sp adr (TSM) Details

Taiwan Semiconductor Manufacturing Company Limited is engaged in manufacturing, selling, packaging, testing, and computer-aided designing integrated circuits and other semiconductor devices. It also manufactures masks. The company is involved in researching, developing, designing, manufacturing, and selling solid state lighting devices and related applications products and systems, as well as renewable energy and saving related technologies and products. In addition, it provides customer and technical support services; and sells and markets solar related products. The company operates in Taiwan, the United States, Asia, Europe, and internationally. Taiwan Semiconductor Manufacturing Company Limited was founded in 1987 and is headquartered in Hsinchu, Taiwan.

Founded in 1987

taiwan semiconductor-sp adr (TSM) Top Compensated Officers

No compensation data is available at this time for the top officers at this company.

Executives, Board Directors

taiwan semiconductor-sp adr (TSM) Key Developments

TSMC Launches Ultra-Low Power Technology Platform for IoT and Wearable Device Applications

TSMC announced the foundry segment's first and most comprehensive ultra-low power technology platform aimed at a wide range of applications for the rapidly evolving Internet of Things (IoT) and wearable device markets that require a wide spectrum of technologies to best serve these diverse applications. In this platform, TSMC offers multiple processes to provide significant power reduction benefits for IoT and wearable products and a comprehensive design ecosystem to accelerate time-to-market for customers. TSMC's ultra-low power process lineup expands from the existing 0.18-micron extremely low leakage (0.18eLL) and 90-nanometer ultra low leakage (90uLL) nodes, and 16-nanometer FinFET technology, to new offerings of 55-nanometer ultra-low power (55ULP), 40ULP and 28ULP, which support processing speeds of up to 1.2GHz. The wide spectrum of ultra-low power processes from 0.18-micron to 16-nanometer FinFET is ideally suited for a variety of smart and power-efficient applications in the IoT and wearable device markets. Radio frequency and embedded Flash memory capabilities are also available in 0.18um to 40nm ultra-low power technologies, enabling system level integration for smaller form factors as well as facilitating wireless connections among IoT products. Compared with their previous low power generations, TSMC's ultra-low power processes can further reduce operating voltages by 20% to 30% to lower both active power and standby power consumption and enable significant increases in battery life -- by 2X to 10X - when much smaller batteries are demanded in IoT/wearable applications. One valuable advantage offered by TSMC's ultra-low power technology platform is that customers can leverage TSMC's existing IP ecosystem through the Open Innovation Platform(R). Designers can easily re-use IPs and libraries built on TSMC's low-power processes for new ultra-low power designs to boost first-silicon success rates and to achieve fast time-to-market product introduction. Some early design engagements with customers using 55ULP, 40ULP and 28ULP nodes are scheduled in 2014 and risk productions are planned in 2015.

Mentor Graphics Corp. and TSMC Collaborate to Deliver IC Design and Signoff Infrastructure for 10nm

Mentor Graphics Corp. announced that it has entered 10nm collaboration with TSMC. Physical design, analysis, verification and optimization tools have been enhanced to meet 10nm FinFET process requirements for early customers' test chip and IP design starts. The infrastructure includes the Olympus-SoC(TM) digital design system, the Analog FastSPICE (AFS(TM)) Platform including AFS Mega, and the Calibre(R) signoff solution. Mentor and TSMC have also enhanced the Calibre fill solution for 10nm FinFET designs. The SmartFill ECO functionality in Calibre YieldEnhancer supports a "fill-as-you-go" flow ensuring that IP and other design blocks are accurately represented as the design progresses. When part of the design is modified, the SmartFill ECO feature can re-fill just the affected portions to minimize turnaround time. Likewise, Calibre LVS has been enhanced to maintain design hierarchy for efficient post-layout simulation at advanced process nodes such as TSMC's 10nm. The two companies have also partnered to make the Mentor(R) Olympus-SoC place and route system ready for TSMC's 10nm FinFET requirements. Significant enhancements have been made to the database, placement, clock tree synthesis, extraction, optimization and routing engines to make them 10nm FinFET compliant. To ensure accurate circuit simulation of 10nm FinFET devices, Mentor collaborated with TSMC to validate BSIM-CMG and TMI models for high-speed device and circuit level simulation on the Analog FastSPICE Platform, including AFS Mega. New 10nm FinFET models are also supported by Calibre xACT(TM) extraction product and the Calibre nmLVS(TM) product.

Taiwan Semiconductor Manufacturing Company Limited Delivers First Fully Functional 16FinFET Networking Processor

Taiwan Semiconductor Manufacturing Company Limited announced that its collaboration with HiSilicon Technologies Co Ltd. has successfully produced the foundry segment's first fully functional ARM-based networking processor withFinFET technology. TSMC's 16FinFET process promises impressive speed and power improvements as well as leakage reduction. All of these advantages overcome challenges that have become critical barriers to further scaling of advanced SoC technology. It has twice the gate density of TSMC's 28HPM process, and operates more than 40% faster at the same total power, or reduces total power over 60% at the same speed. TSMC's 16FinFET has entered risk production with excellent yields after completing all reliability qualifications in November 2013. This paves the way for TSMC and customers to engage in more future product tape-outs, pilot activities and early sampling. Built on TSMC's 16FinFET process, HiSilicon's new processor enables a significant leap in performance and power optimization supporting high-end networking applications. By leveraging TSMC's production-proven heterogeneous CoWoS(R) (Chip-on-Wafer-on-Substrate) 3D IC packaging process, HiSilicon integrates its 16-nanometer logic chips with a 28-nanometer I/O chip for a cost-effective system solution.

 

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Industry Analysis

TSM

Industry Average

Valuation TSM Industry Range
Price/Earnings 15.3x
Price/Sales 4.8x
Price/Book 3.5x
Price/Cash Flow 15.3x
TEV/Sales 3.9x
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