Last $2.86 USD
Change Today -0.07 / -2.39%
Volume 62.1K
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As of 3:18 PM 07/23/14 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

400 Kato Terrace

Fremont, CA 94539

United States

Phone: 510-623-9400

Fax: 510-623-9450

Aehr Test Systems designs, engineers, and manufactures test and burn-in equipment used in the semiconductor industry. The company's systems can be used to simultaneously perform parallel testing and burn-in of packaged integrated circuits (ICs), singulated bare die, or ICs still in wafer form. Products The company manufactures and markets full wafer contact test systems, test during burn-in systems, test fixtures, die carriers, and related accessories. The company’s systems are modular, allowing them to be configured with optional features to meet customer requirements. Full Wafer Contact Systems The FOX-1 full wafer parallel test system is designed for massively parallel test in wafer sort. The FOX-1 system is designed to make electrical contact to and test the die on a wafer in a single touchdown. The FOX-1 test head and WaferPak contactor are compatible with industry-standard 300 mm wafer probers, which provide the wafer handling and alignment automation for the FOX-1 system. The FOX-1 pattern generator is designed to functionally test industry-standard memory, such as flash and DRAMs, plus it is optimized to test memory or logic ICs that incorporate design for testability, and built-in self-test. The FOX-1 pin electronics and per-device power supplies are tailored to full-wafer functional test. The company is in development of the next generation FOX system funded through a development agreement with a semiconductor manufacturer. The FOX-15 full wafer contact test and burn-in system is designed for use with wafers that require test and burn-in times typically measured in hours. The FOX-15 is focused on parallel testing and burning-in up to 15 wafers at a time. For high reliability applications, such as automotive, the FOX-15 system is a solution for producing tested and burned-in die for use in multi-chip packages. The key component of the FOX systems is the patented WaferPak cartridge system. The WaferPak cartridge contains a full-wafer single-touchdown probe card which is removable from the system. Traditional probe cards contact a portion of the wafer, requiring multiple touchdowns to test the entire wafer. The design is intended to accommodate a range of contactor technologies so that the contactor technology can evolve along with the changing requirements of the customer’s wafers. Systems for Packaged Parts Test during burn-in systems consist of various subsystems: pattern generation and test electronics, control software, network interface and environmental chamber. The test pattern generator allows duplication of most of the functional tests performed by a traditional tester. Pin electronics at each burn-in board (BIB) position are designed to provide accurate signals to the ICs being tested and detect whether a device is failing the test. Devices being tested are placed on BIBs and loaded into environmental chambers which typically operate at temperatures from 25 degrees Celsius (77 degrees Fahrenheit) up to 150 degrees Celsius (302 degrees Fahrenheit) (optional chambers can produce temperatures as low as -55 degrees Celsius (-67 degrees Fahrenheit)). The Advanced Burn-in and Test System (ABTS) family of products is based on a new hardware and software architecture. The ABTS system can test and burn-in both high-power logic and low-power ICs. It can be configured to provide individual device temperature control for devices up to 70W or more and with up to 320 I/O channels. Test Fixtures The company sells, and licenses others to manufacture and sell, custom-designed test fixtures for its systems. The test fixtures include BIBs for the ABTS parallel test and burn-in system and for the MAX monitored burn-in system. These test fixtures hold the devices undergoing test or burn-in and electrically connect the devices under test to the system electronics. Test fixtures are sold both with new Aehr Test systems and for use with the company’s installed base of systems. The company’s DiePak product line includes a family of reusable, temporary die carriers and associated sockets that enable the test and burn-in of bare die using the same test and burn-in systems used for packaged IC

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Price/Sales 1.7x
Price/Book 4.6x
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TEV/Sales 1.5x

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