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Company Description

Contact Info

3050 Bowers Avenue

PO Box 58039

Santa Clara, CA 95052

United States

Phone: 408-727-5555

Fax: 408-748-9943

Applied Materials, Inc. provides manufacturing equipment, services and software to the global semiconductor, flat panel display, solar photovoltaic (PV), and related industries. Segments The company’s segments include Silicon Systems Group, Applied Global Services, Display, and Energy and Environmental Solutions. Silicon Systems Group Segment This segment develops, manufactures, and sells manufacturing equipment used to fabricate semiconductor chips, also referred to as integrated circuits (ICs). Most chips are built on a silicon wafer base and include various circuit components, such as transistors and other devices, that are connected by multiple layers of wiring (interconnects). Applied offers systems that perform various processes used in chip fabrication, including atomic layer deposition (ALD), chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), rapid thermal processing (RTP), ion implantation, chemical mechanical planarization (CMP), wet cleaning, and wafer metrology and inspection, as well as systems that etch or inspect circuit patterns on masks used in the photolithography process. The company’s semiconductor manufacturing systems are used by integrated device manufacturers and foundries to build and package memory, logic, and other types of chips. The majority of the company's new equipment sales are for leading-edge technology for advanced nodes using 28 nanometer (nm) and smaller dimensions. The company is a supplier of systems for manufacturing copper-based interconnects, including equipment for depositing, etching, and planarizing these multi-layer structures. It provides systems for depositing low k dielectric films that enable higher device performance and longer battery life. Major chipmakers are integrating high dielectric constant (high-k) and metal materials and processes in their transistor gate structures to increase chip performance and reduce power consumption. The company has fully characterized processes for building these high-k/metal gates. These solutions include an integrated dielectric gate stack tool that combines four critical processes in a single system, a portfolio of metallization technologies using ALD and PVD, and a high temperature etch system. The company sells most of its single-wafer, multi-chamber systems on six basic platforms: the Endura, Centura, Producer, Raider, VIISta, and Vantage platforms. These platforms support ALD, CVD, ECD, PVD, etch, ion implantation, and RTP technologies. The company also offers earlier-generation 200mm systems, as well as products and services to support all of its systems, which are reported under its Applied Global Services segment. Deposition The company provides equipment to perform four types of deposition: ALD, CVD, ECD and PVD. In addition, its RTP systems can be used to perform certain types of dielectric deposition. ALD ALD is an advanced technology in which atoms are deposited one layer at a time to build chip structures. This technology enables customers to fabricate thin films of either conducting or insulating material with uniform coverage in nm-sized structures. CVD CVD is used to deposit dielectric and metal films on a wafer. During the CVD process, gases that contain atoms of the material to be deposited react on the wafer surface, forming a thin film of solid material. Films deposited by CVD may be silicon oxide, single-crystal epitaxial silicon, amorphous silicon, silicon nitride, dielectric anti-reflective coatings, low k dielectric (for highly-efficient insulating materials), aluminum, titanium, titanium nitride, polysilicon, tungsten, refractory metals or silicides. The company offers the following CVD products and technologies: The Applied Producer CVD platform: The Producer high-throughput platform features Twin-Chamber modules that have two single-wafer process chambers per unit. Up to three Twin-Chamber modules can be mounted on each Producer platform, giving it a simultaneous processing capacity of six wafers. Many dielectric CVD processes can be performed on this platform. Low k Dielectric Films: Low k dielectric materials are


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