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Company Description

Contact Info

3050 Bowers Avenue

PO Box 58039

Santa Clara, CA 95052

United States

Phone: 408-727-5555

Fax: 408-748-9943

mber of times the wafer passes through the beam; the depth of the dopants is determined by the energy of beam. Ion implantation systems may also be used in other areas of IC manufacturing to modify the material properties of the semiconductor devices, as well as in manufacturing crystalline-silicon solar cells. The company offers a line of single-wafer ion implantation equipment that covers the entire energy and current range required to manufacture advanced devices. The VIISta 3000XP implanter delivers the angle precision required for advanced high-energy applications, while the VIISta 900XP implanter provides medium current precision doping. The VIISta PLAD implanter enables manufacturers to rapidly implant high dopant concentrations over the entire wafer using a low-energy process that preserves sensitive circuit features in next-generation devices. The VIISta Trident high current ion implanter provides the precise dose and angle control needed for advanced transistor structures. CMP The CMP process removes material from a wafer to create a flat (planarized) surface. The company has led the industry with its 300mm Applied Reflexion LK system, with features, such as integrated cleaning, film measurement and process control capabilities. Metrology and Wafer Inspection The company offers various products for measuring features and inspecting defects on the wafer during various stages of the fabrication process. These systems enable customers to characterize and control critical dimension (CD) and defect issues, especially at advanced generation technology nodes. CD and Defect Review Scanning Electron Microscopes (CD-SEMs and DR-SEMs): SEMs use an electron beam to form images of microscopic features of a patterned wafer at high magnification. The company’s SEM products provide customers with full automation, along with the high accuracy and sensitivity needed for measuring very small CDs. The Applied VeritySEM 4i+ metrology system uses proprietary SEM imaging technology to enable precise control of the lithography and etching processes, measuring CDs at a precision of approximately 0.3nm. The company’s OPC Check software for the VeritySEM system performs automated qualification of OPC-based (optical proximity correction) chip designs, significantly reducing mask verification time over conventional manual methods. In 2013, the company introduced the latest generation of defect review and classification technology with its Applied SEMVision G6 system, designed to accelerate time-to-yield for leading-edge chip manufacturing at the 1X-nm node and beyond. Wafer Inspection: Using deep ultraviolet laser-based technology, defects can be detected on patterned wafers (wafers with printed circuit images) as they move between processing steps. Defects include particles, open circuit lines, and shorts between lines. The Applied UVision 5 wafer inspection system detects yield-limiting defects in the critical patterning layers of logic and memory devices. Mask Making Masks are used by photolithography systems to transfer microscopic circuit designs onto wafers. Applied provides systems for etching and inspecting masks. The Applied Centura Tetra EUV (extreme ultraviolet) Advanced Reticle Etch system is an advanced etch tool for fabricating leading-edge masks at 22nm and below. The Applied Aera3 Mask inspection system also addresses the challenges of detecting defects on 22nm masks, using aerial imaging technology that allows users to immediately see how the pattern on the mask would appear on the wafer, revealing only the defects most likely to print and significantly reducing inspection time. These systems also address the challenge of fabricating emerging EUV lithography masks. Applied Global Services Segment This segment encompasses services, products and integrated solutions to optimize equipment and fab performance and productivity. Utilizing the company's experience with complex manufacturing technology and processes, skilled equipment and process engineers are deployed at or near customer sites in various countries to support approximately 33,000 installed Applied semiconductor, display, and sola

 

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AMAT

Industry Average

Valuation AMAT Industry Range
Price/Earnings 28.1x
Price/Sales 3.4x
Price/Book 3.9x
Price/Cash Flow 27.9x
TEV/Sales 2.8x
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