Last $17.29 USD
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Company Description

Contact Info

901 Fifth Avenue

Suite 1000

Seattle, WA 98164

United States

Phone: 206-701-2000

Fax: 206-701-2500

www.cray.com

Cray Inc. designs, develops, manufactures, markets, and services high-performance computing (HPC) systems, commonly known as supercomputers, and provides storage solutions and engineering services related to HPC systems and solutions to customers, which include government agencies, academic institutions and commercial entities. HPC Systems Cray XE6 System: The Cray XE6 system is a massively parallel processing (MPP) system and is the successor system to the Cray XT6, Cray XT5, Cray XT4 and Cray XT3 systems. The Cray XE6 system has high memory bandwidth, supporting very high density processor configurations of 192 AMD Opteron processor sockets or up to 3,072 processor cores and delivering approximately 20 teraflops (20 trillion floating point operations per second) of computational capacity per cabinet, with system peak and sustained performance designed to exceed 10 petaflops. Customers can upgrade to the Cray XE6 system from the Cray XT4, Cray XT5 or Cray XT6 systems by upgrading the network, processors, memory and a compute blade or they can choose to just upgrade the network to create a Cray XE5 system. The Cray XE6 system can be liquid cooled through use of Cray ECOphlex technology or air cooled. Cray XE6m System: Cray XE6m supercomputer is designed to make HPC technology available to more users by targeting a lower price band in the supercomputer market segment. The Cray XE6m system incorporates Cray Gemini network specially designed and optimized for systems with peak performances starting at under seven teraflops and scaling to high-end systems. Offered with up to six cabinets, the Cray XE6m series features multi-core AMD Opteron processors and can be liquid cooled through use of Cray ECOphlex technology or air cooled. Cray XK6 System: The Cray XK6 supercomputer combines Gemini interconnect, AMD’s multi-core scalar processors and NVIDIA’s many-core graphical processor units (GPU) processors to create a productive hybrid supercomputer. Cray XK6m System: The Cray XK6m supercomputer utilizes all of the technology in the Cray XE6m system and integrates GPUs. Adaptive Supercomputing Vision and Cascade Program The company’s ‘Cascade’ activities are co-funded by the U.S. government. Under funding agreement with the Defense Advanced Research Projects Agency (DARPA), the company is in the process of completing the development of a prototype system that demonstrates the functionality required for scaling to multiple sustained petaflops levels of performance on real applications. YarcData Division Future ‘Big Data’ Analytics Solution: YarcData division focuses on providing solutions to the ‘big data’ market by extending supercomputing platform to data analytics problems. This system is used for massive unstructured and irregular data mining problems. The design is based on a Cray XT compute blade but utilizes custom Cray Threadstorm processors developed for massively multithreaded processing. A single Cray Threadstorm processor can sustain 128 simultaneous threads and is connected to memory that is globally accessible by any other Cray Threadstorm processor in the system. Storage and Data Management Cray Sonexion 1300: The company offers storage and data management solutions and select the combination of functionality for each customer project. With the introduction of the Cray Sonexion 1300 integrated storage system, the company provides HPC customers with a high capacity integrated Lustre solution. In addition, the company supports partner storage offerings from companies, such as Data Direct Networks and NetApp through esFS solutions. The new Cray Sonexion 1300 system is a storage system that takes use of the Lustre file system at any scale in scale-out network attached storage (NAS) solution. The system combines hardware and software technology into a modular design that scales from a hundred terabytes to petabytes. Services Custom Engineering: The company provides deliverables ranging from specific components to complete integrated systems, focusing on custom-designed hardware, software, packaging, power and cooling solutions to address an HPC customer’s challenges in special pro

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