Last $0.47 USD
Change Today -0.009 / -1.88%
Volume 41.9K
LEDS On Other Exchanges
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As of 3:08 PM 11/24/14 All times are local (Market data is delayed by at least 15 minutes).
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Company Description

Contact Info

No. 11 Ke Jung Road

3rd Floor

Chu-Nan Site

Hsinchu Science Park

Chunan, 350

Taiwan

Phone: 886 37 586788

Fax:

SemiLEDs Corporation develops, manufactures, and sells light emitting diodes (LED) chips and LED components. The company’s products are used primarily for general lighting applications, including street lights and commercial, industrial, and residential lighting. Its LED chips might also be used in specialty industrial applications, such as ultraviolet (UV) curing of polymers, LED light therapy in medical/cosmetic applications, counterfeit detection, LED lighting for horticulture applications, and architectural lighting. The company sells blue, green, and UV LED chips under its MvpLED brand to a customer base that is concentrated in various select markets, including Taiwan, the United States, Russia, and China. It also sells its new ‘Enhanced Vertical’ (EV) LED product series in blue, green, and UV. The company sells its LED chips to packaging customers or to distributors, who in turn sell to packagers. The company also contracts other manufacturers to produce for its sale certain LED products, and for certain aspects of its product fabrication, assembly and packaging processes, based on its design and technology requirements and under its quality control specifications and final inspection process. The company owns 87% interest in Ning Xiang Technology Co., Ltd. (Ning Xiang), which is engaged in the design, manufacture, and sale of lighting fixtures and systems. As of August 31, 2013, the company owned a 50% interest in SILQ (Malaysia) Sdn. Bhd., a joint venture established in Malaysia to design, manufacture, and sell lighting fixtures and systems. In November 2013, the company announced the launch of its new 10-watt M63 RGBW integrated 6363 LED, capable of delivering approximately 410 total lumens of combined red, green, blue, and white light output. The M63 RGBW LED component integrates the company’s vertical LED structure, white color chip, and ceramic packaging technologies, designed for a range of color-changing applications, including entertainment lighting (such as stage lights, backdrops and spotlighting), large scale displays, and architectural lighting. LED Chips The company produces various blue, green, and UV LED chips, including its new EV LED product series, ranging from chip sizes of 380 microns (µm) by 380µm to 1520µm by 1520µm, which are capable of providing approximately 120 lumens per watt when properly packaged as cool white emitters. LED Components The company packages a portion of its LED chips into LED components for sale to distributors and end-customers in selected markets. The majority of its LED components use its 1200µm by 1200µm, 1070µm by 1070µm and 860µm by 860µm chips, majority of which are combined with phosphors to produce components with various color temperatures. In 2012, the company launched its C35 emitters that incorporate its EV LED chips and feature narrow binning, low thermal resistance and a special optical design. In June 2013, the company expanded its UV LED product portfolio with the launch of its mid-power P50N product series and high-power N9 product series, designed for industrial applications, such as printing, coating, curing, signage, and medical/cosmetic uses. It also introduced low-power 3020 product series and 5mm through-hole lamp type UV LED components to its LED components portfolio in January 2013. In July 2013, the company acquired an additional LED components production line and added a range of LED components products to its existing portfolio, including LED emitters ranging from 1 watt to 50 watts, and LED modules for lighting applications. These LED components products are used primarily for general lighting applications, including residential, commercial and industrial lighting, and industrial applications, such as UV curing and horticulture applications. The company’s packaging process includes chip bonding, wire bonding, phosphor coating, encapsulation, scribing, dicing, and testing. Lighting Products The company designs, assembles, and sells lighting fixtures and systems for general lighting applications, including commercial, residential and industrial lighting. Its lighting products consist primarily of LED lumin

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