Last $72.13 USD
Change Today +0.48 / 0.67%
Volume 1.6M
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Company Description

Contact Info

4650 Cushing Parkway

Fremont, CA 94538

United States

Phone: 510-572-0200

Fax:

Lam Research Corporation offers wafer fabrication equipment and services to the semiconductor industry. The company designs, manufactures, markets, refurbishes, and services semiconductor processing systems that are used in the fabrication of integrated circuits (ICs). The company’s products are designed to help its customers build the smaller, faster, and more power-efficient devices that are used in various electronic products, including cell phones, computers, storage devices, and networking equipment. The company’s customer base includes semiconductor memory, foundry, and integrated device manufacturers (IDMs) that make products such as DRAM, NAND memory, and logic devices. Products Thin Film Deposition Copper Metal Films — SABRE Product Family The SABRE ECD (electrochemical deposition) product family is a platform for copper damascene manufacturing. System capabilities include deposition of copper directly on various liner materials. Applications include copper deposition for both advanced logic and memory interconnect. The company also offers the SABRE 3D system to address through-silicon via (TSV) and wafer-level packaging (WLP) applications, such as copper pillar, redistribution layer (RDL), underbump metallization, bumping, and microbumps used in post-TSV processing. Tungsten Metal Films — ALTUS Product Family The company’s ALTUS systems deposit highly conformal atomic layer films for advanced tungsten metallization applications. The patented Multi-Station Sequential Deposition (MSSD) architecture enables a nucleation layer to be formed using Pulsed Nucleation Layer (PNL) technology and bulk chemical vapor deposition (CVD) fill to be performed in situ. Plasma-enhanced CVD (PECVD) Dielectric Films — VECTOR Product Family The company’s VECTOR family of PECVD/atomic layer deposition (ALD) systems delivers thin film quality, wafer-to-wafer uniformity, and productivity. VECTOR products offer specialized systems for logic and memory applications. VECTOR Express offers a small footprint with four processing stations. VECTOR Excel is a tool for technology nodes where pre-and-post film deposition treatments are needed. VECTOR Extreme accommodates up to 12 processing stations for high-throughput memory processes. Applications include deposition of ashable hardmasks, multiple patterning films, oxides, nitrides, carbides, anti-reflective layers, multi-layer stack films, diffusion barriers, and spacer films. Gapfill Dielectric Films — SPEED Product Family The company’s SPEED high-density plasma CVD (HDP-CVD) products provide void-free gapfill of dielectric films. Applications include shallow trench isolation (STI), pre-metal dielectrics, inter-layer dielectrics, inter-metal dielectrics, and passivation layers. Film Treatment — SOLA Product Family The SOLA ultraviolet thermal processing (UVTP) product family is used for treatment of back-end-of-line (BEOL) low-k dielectric films and front-end-of-line (FEOL) silicon nitride strained films. The systems incorporate a proprietary treatment process that modifies the physical characteristics of a previously deposited film through exposure to ultraviolet light, gases and vapors, and heat. Plasma Etch Conductor Etch — 2300 Kiyo Product Family, 2300 Versys Metal Product Family The 2300 Kiyo product family delivers solutions for conductor etch applications. Kiyo systems can be configured to perform atomic layer etch (ALE), which delivers atomic-scale variability control to enable next-generation wafer processing. Dielectric Etch — 2300 Flex Product Family The 2300 Flex product family offers technologies and application-focused capabilities for critical dielectric etch applications. Applications include low-k and ultra low-k dual damascene, self-aligned contacts, capacitor cell, mask open, 3D NAND HAR hole, trench, and contact. TSV Etch — 2300 Syndion Product Family The 2300 Syndion TSV etch family provides low-risk, flexible solutions to address multiple TSV etch applications. The systems support both conventional single-step etch and rapidly alternating process (RAP). Photoresist Strip With the semiconductor industry’s

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LRCX

Industry Average

Valuation LRCX Industry Range
Price/Earnings 19.8x
Price/Sales 2.5x
Price/Book 2.3x
Price/Cash Flow 18.4x
TEV/Sales 1.5x
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