Last $3.92 USD
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Company Description

Contact Info

No. 18 Zhangjiang Road

Pudong New Area

Shanghai, 201203

China

Phone: 86 21 3861 0000

Fax: 86 21 5080 2868

Semiconductor Manufacturing International Corporation provides integrated circuit (IC) foundry services. The company has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai, a 300mm mega-fab in Beijing, a 200mm fab in Tianjin, and a 200mm fab project under development in Shenzhen. Products and Services Manufacturing of Wafers and Manufacturing Capacity The company manufactures silicon wafers based on proprietary designs provided by its customers or third party designers. Its factories manufacture the following types of semiconductors: Logic, (including basebands, microprocessors, DSPs and application processors); Mixed-Signal and RF (for wired and wireless connectivity applications for communications and consumer electronics); High Voltage (for display driver integrated circuits, power supplies, power management, telecommunications, automotive electronics and industrial controls); Memory, (including standalone SRAM, EEPROM and Flash, and embedded NVM for IC cards to be used in transport, banking, social welfare and national ID); CIS (CMOS Image Sensors that are used in a range of camera-related systems); and Others, (Micro Electrical and Mechanical System, or MEMS and Integrated Passive Devices). Integrated Solutions In addition to wafer fabrication, the company provides its customers with a range of complementary services, from circuit design support and mask-making to wafer level probing and testing. This range of services is supported by its network of partners that assist in providing design, probing, final testing, packaging, assembly and distribution services. Design Support Services The company’s design support services provide its customers with access to the fundamental technology files and libraries that facilitate customers’ own integrated circuit design. It also offers design reference flows and access to its design center alliance, as well as layout services to its customers. In addition, the company collaborates with companies in electronic design automation, library and IP (intellectual property) services to create a worldwide network of expertise, resources and services that are available to its customers. Wafer Probing, Assembly and Testing Services The company has its own probing facilities in Shanghai and Beijing that provide test program development, probe card fabrication, wafer probing, failure analysis, and failure testing. The company also outsources these services to its partners. The company has established a network of partners that provide additional probing services, as well as assembly and testing services, to serve its customers. Sales and Marketing The company has customer service and marketing offices located in the U.S., Europe, Japan, mainland China and Taiwan and a representative office in Hong Kong. The company’s mainland China offices serve mainland China, Hong Kong and other non-Japan, non-Taiwan Asian markets, its U.S. office serves the North American market, its Taiwan Office serves the Taiwan market and its Europe and Japan offices serve the European and Japanese markets, respectively. Significant Events In August 2013, Semiconductor Manufacturing International Corp. has set up a new joint venture with Semiconductor Manufacturing Corp, Beijing Industrial Development Investment Management Co., and Zhongguancun Development Group in Beijing to further expand its production with specific focus on 45 nanometer and other advanced wafers. In October 2013, Semiconductor Manufacturing International Corporation announced the formation of SMIC's Center for Vision, Sensors and 3DIC (CVS3D). CVS3D consolidates and strengthens SMIC's R&D and manufacturing capabilities for silicon-based sensors, thru-silicon-via (TSV) technology and other middle-end wafer process (MEWP) technologies. In December 2013, eMemory and the company announced that they plan to expand the deployment of their current collaboration on its eNVM platform development. The platform covers both One Time Programmable and Multiple Times Programmable eNVM technologies, such as NeoBit, NeoFuse, NeoEE and NeoMTP, across a range of technology nodes ranging from 0.35um to 40nm. In February 2014, Semiconductor Manufacturing International Corp. and Jiangsu Changjiang Electronics Technology Co., Ltd. jointly announced a joint venture for 12 inches bumping and related testing. Competition The company’s competitors are other pure-play foundries such as TSMC, UMC and Global Foundries. Another group of potential competitors consists of IDMs that have established their own foundry capabilities include Fujitsu Limited, Samsung Electronics Co., Ltd. and IBM. History Semiconductor Manufacturing International Corporation was founded in 2000.

 

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