Businessweek

STMicroelectronics N.V. operates as an independent semiconductor company that designs, develops, manufactures, and markets a range of semiconductor products used in various microelectronic applications, including automotive products, computer peripherals, telecommunications systems, consumer products, industrial automation, and control systems. Product Segments The company’s products include discretes, microcontrollers, Smartcard products, standard commodity components, MEMS and advanced analog products, application-specific integrated circuits (ASICs) (full-custom devices and semi-custom devices), and application-specific standard products (ASSPs) for analog, digital, and mixed-signal applications. The company’s products segments include Automotive; Digital; Analog, MEMS and Microcontrollers Sector (AMM); Power Discrete Product (PDP); and Wireless. The company also designs, develops, manufactures, and markets subsystems and modules for various products in the telecommunications, automotive, and industrial markets in its Subsystems division. Automotive This segment’s automotive products include digital and mixed signal devices that enable features like airbag controls, anti skid braking systems, vehicle stability control, ignition and injection circuits, multiplex wiring, radio frequency (RF) and power management for body and chassis electronics, engine management, advanced safety, instrumentation, car radio, and infotainment. In addition to its own products and technologies, the company also works with Freescale Semiconductor on 90nm and 55nm embedded Flash Technology and other common products based on 32-bit microcontrollers for use in various automotive applications. Power Train and Safety Division: The company designs and manufactures smart power products to improve performance, safety, and comfort while reducing the environmental impact of the automobile. For powertrain and safety, its products are used for engine emissions and fuel economy improvements, passive and active safety systems, and powertrain electrification with mixed signal power management power driver and analog signal processing. Body and Audio Division: The company designs and manufactures power and smart power products addressing applications like air conditioning, lighting (including Xenon), car connectivity, dashboard, body, and comfort. In addition, in 2012, the company introduced the new generation class D power audio amplifier in both the analog and digital domains. Micro and RF Division: The company designs and produces products to provide a solution in the digital area of automotive applications. It provides a range of 32-bit microcontrollers to cover all the different applications of the automotive industry, from power train to passive and active safety, to body and convenience. The company also creates solutions for automotive infotainment analog, including tolling, navigation, and telematics applications. It provides global positioning navigation, media processing, audio amplification, and signal processing. The company also supplies components to satellite radio applications, including base band products to market leaders in this area. Digital The Digital Segment comprises two product lines, Digital Convergence Group (DCG) and Imaging, Bi-CMOS (complementary metal on silicon oxide semiconductor) ASIC and Silicon Photonics Group (IBP). DCG The company provides a solution across a range of applications for delivering high-definition content and rich services to end users, from complex ASICs for network infrastructure and gaming to ASSPs for digital set-top boxes, monitors, and digital TV. During 2012, the company introduced its DOCSIS 3.0 products for new high-speed cable networks. IBP The IBP Group’s activities focus on developing power solutions and systems for Bi-CMOS ASIC & Silicon Photonics, as well as Imaging products. Bi-CMOS ASIC & Silicon Photonics: The company is focused on developing products for RF, optical integrated circuits (ICs), and silicon photonics. In 2012, its Bi-CMOS process family for communications infrastructure included RF ICs for base stations and ICs for optical interc